Interconnection


Discrete IDC contacts

16 August 2017 Interconnection

AVX has released the new STRIPT 9177-500 series single IDC contacts for #12 – #18 AWG wire-to-board terminations in harsh industrial, transportation, outdoor and alternative energy applications. These latest additions to the STRIPT family of UL-approved, insulator-less single contacts provide a cost-effective solution for quickly, easily and reliably terminating individual high-current or high-voltage solid or stranded wires onto a PCB using a proven, gas-tight contact system.

Designed to support large wire gauges from both a robustness and current rating perspective, the new contacts enable wire-to-board connections up to 15 A and 600 V, and are built to withstand extreme temperatures, shock and vibration. The highly reliable cold-welded connections they enable are also compatible with potting and overmoulding encapsulation processes, allowing users to further protect the electronics from extreme environmental conditions including water ingress.

Ideal for use in solar and other alternative energy systems, outdoor and transportation lighting, commercial building wiring and electrical systems, and industrial motor controls, drives and pumps, each proven phosphor bronze IDC contact features a redundant contact system for enhanced wire retention and high current-carrying capabilities.

For more information contact Pieter Engelbrecht, Avnet South Africa, +27 (0)11 319 8600, [email protected], www.avnet.co.za





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High-speed high-density connectors from Withwave
RFiber Solutions Interconnection
The high-speed high density open pin field array connectors have excellent higher bandwidth applications and are capable of data throughput of up to 112 Gbps.

Read more...
Build a high-speed board-to-board mated set in under a minute
Spectrum Concepts Interconnection
The latest implementation of Samtec’s Solutionator now covers the high-speed board-to-board products with the High-Speed Board-to-Board Solutionator to present a full mated set solution.

Read more...
Low-PIM cable assembly application considerations
RF Design Interconnection
Given the diverse range of applications for coaxial cable assemblies, these cables are not one-size-fits-all. This article discusses three main types, low-PIM, low-loss, and phase-stable coaxial cable assemblies.

Read more...
Short body USB-A with no compromise on performance
Electrocomp Interconnection
The all-new USB1125 connector from GCT with a minimal PCB footprint of just 13mm2 is 25% smaller than full-size equivalents.

Read more...
The new VITA 90 landing page
Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.

Read more...
The new VITA 90 landing page
Spectrum Concepts Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.

Read more...
New precision standoffs for ultra-rugged applications
Spectrum Concepts Interconnection
Samtec has launched its new precision PCB standoffs used to either separate printed circuit boards, or to create space between the PCB and the mounting chassis.

Read more...
Phase-stable cable assemblies operate up to 50 GHz
RF Design Interconnection
The Lab-Flex T series from Smiths Interconnect are low-loss high-frequency cables that have minimal phase change with changing temperature and flexure.

Read more...
Samtec has reorganised its AcceleRate products online
Spectrum Concepts Interconnection
Samtec recently reorganised its family of AcceleRate products into one webpage to enable easier browsing and comparison of products when trying to find the best high-performance solution for the given application.

Read more...
Samtec high-speed interconnects in next-gen UAS
Spectrum Concepts Interconnection
The unmanned aircraft system framework 2.0 autopilot platform utilises several of Samtec’s high-speed board-to-board interconnects for the transfer of data between various add-on boards.

Read more...