Computer/Embedded Technology


Fanless technology overcomes the PC’s nemeses

15 November 2017 Computer/Embedded Technology

Heat has always been an issue with electronics. As the components get hotter they begin to behave erratically until they fail completely. The CPU is the most important component of a PC and the component that receives the most attention with cooling heatsinks and fans.

In some cases, use is even made of liquid cooling systems to cool CPUs that are overclocked, but fans are noisy and even the best designed fan and computer case do not completely eliminate the noise of the fan.

Dust is the next big killer because it is attracted by static to the cooling veins of the heatsinks that are placed on CPUs. Build-up of dust can completely clog the cooling veins, making the heatsink totally useless and even a liability as it can become a fire hazard. Regular maintenance should be done to clean the cooling veins of the CPU and also the power supplies, which are another source of heat within a PC.

In industrial situations, there is often both dust and heat in the environment in which an industrial PC is expected to operate. Industrial computers have always been fitted with removable filters over the fans of the chassis so that they can be regularly cleaned or replaced. However, this does not always happen when it should, with the result that the PC overheats and fails. In a situation where the PC is controlling a production line or factory the cost of the loss of production and downtime can be huge compared to the cost of replacing the filters regularly.

The big issue was always that the power of the CPU generated a lot of heat that had to be dissipated by the heatsink and fans. As CPUs became more powerful their power consumption increased and with it their heat output. Fortunately, PC CPU technology has advanced dramatically and even powerful CPUs such as the Intel i5 are now available with relatively low heat signatures. This has led to the advent of fanless PCs.

By using better heatsinks and other methods, the heat from the CPU is dissipated through the chassis of the PC and no fans are required. The chassis of the PC can be completely closed, thus excluding dust and ensuring quiet operation and freedom from maintenance of fan filters and heatsinks.

For industrial users, this means that PCs can be installed close to the production line without extra enclosures and cooling. In situations where a PC must be placed in a remote location, it means that the reliability of the PC is improved and less monitoring or maintenance is required.

Centurion Micro Electronics can supply a range of fanless PCs and panel PCs for industrial and commercial use.

For more information contact Henry Hugo, Centurion Micro Electronics, +27 (0)83 581 4549, henry@cme.co.za, www.cme.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High-speed synchroniser and distribution board
28 October 2020, Rugged Interconnect Technologies , Computer/Embedded Technology
Pentek introduced a new board to the Quartz RFSoC architecture family, the Model 5903, a 3U VPX high-speed synchroniser and distribution board, optimised for Pentek products using the Xilinx Zynq UltraScale+ ...

Read more...
BC200 Boxed Rugged Industrial Configurable PC
31 August 2020, Rugged Interconnect Technologies , Computer/Embedded Technology
• Based on proven 3U CompactPCI.Serial technologies • The system is user configurable for unlimited solutions supporting: • 4HP/8HP Processor boards configured with I/O side cards • 4HP/8HP Peripheral ...

Read more...
Data recorder qualified for aerospace
31 August 2020, Rugged Interconnect Technologies , Computer/Embedded Technology
The Galleon G1 microRecorder is a powerful gigabit and 10Gb Ethernet recorder in an extremely small enclosure. It is designed to meet the most severe environmental conditions without compromising on functionality ...

Read more...
11th Gen Intel Core processors with new design options
30 September 2020 , Computer/Embedded Technology
In parallel with the 11th Gen Intel Core processor launch (code named Tiger Lake), congatec has launched both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. ...

Read more...
PCIe board for wireless applications
29 July 2020, Rugged Interconnect Technologies , Computer/Embedded Technology
Pentek introduced an addition to the Quartz RFSoC architecture family, the Model 7050, an eight-channel A/D and D/A converter, PCIe double-wide board based on the Xilinx Zynq UltraScale+ RFSoC. The Model ...

Read more...
Configured computing systems and individual elements
29 July 2020, Vepac Electronics , Computer/Embedded Technology
Verotec has a selection of configured systems plus individual elements such as backplanes, power supplies and cooling products, which are compliant with the PICMG/VITA specifications, and supported by ...

Read more...
Pentek accelerates real-time recording
29 July 2020, Rugged Interconnect Technologies , Computer/Embedded Technology
Pentek has introduced a new addition to the Talon series of recorders, the Model RTR 2757 4U 19-inch rackmount recorder. This new recorder complements Pentek’s Quartz RFSoC products that stream digitised ...

Read more...
Backplanes for various computing architectures
30 June 2020, Vepac Electronics , Computer/Embedded Technology
Verotec designs, supplies and integrates bus-based products and systems. Its extensive standard range consists of open-architecture backplanes and extender boards for VME, VME64x, VXI, VPX, VXS, CompactPCI, ...

Read more...
PCIe Gen 4 switches
30 June 2020 , Computer/Embedded Technology
To support cloud, data centre and hyperscale computing that facilitates advancements in artificial intelligence (AI) and machine learning (ML), Microchip Technology released to production its Switchtec ...

Read more...
Solid-state drive based on QLC technology
29 April 2020, Altron Arrow , Computer/Embedded Technology
Micron Technology announced new Micron 5210 ION enterprise SATA SSD capacity and features, solidifying its leadership in QLC (quad-level cell) technology volume production. The world’s first QLC solid-state ...

Read more...