1 January 2018
Manufacturing / Production Technology, Hardware & Services
KOKI announced a newly developed, general application solder paste with highly balanced SMT performance, in the form of S3X58-G801.
In today’s manufacturing environment, a totally balanced, high-performance solder paste with features like high wetting, ultra-low solder balling and low voiding, is required. At the same time, more emphasis is placed on achieving a stable printing process, so a stable viscosity is vital.
S3X58-G801 is engineered with a highly heat-resistant flux that stays inactive at ambient temperature, thereby ensuring stable viscosity of the solder paste on the shelf and during continuous printing. This heat resistance effectively prevents heat-slump and eliminates the occurrence of solder balls. Furthermore, the solder paste achieves low voiding thanks to the newly engineered and improved fluidity of the flux which reduces the generation of gas during the reduction reaction.
S3X58-G801 is a process-friendly, drop-in replacement solder paste that reduces the hassle of changing the material and ensures high-quality solder joints.
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