ON Semiconductor has released two new boards, or shields, further extending its recently launched Internet of Things (IoT) Development Kit (IDK) platform’s capabilities. With the addition of two new shields that include Bluetooth low energy technology and smart passive sensors (SPS), customers are now able to create diverse and unique use cases that target smart home/building, smart city, industrial automation and mHealth applications.
The Bluetooth low energy shield features the recently launched RSL10 multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC). With the industry’s lowest deep sleep current and receive power, the RSL10 enables manufacturers to create IoT devices with extended battery life. The small form factor of the RSL10 delivers the ultra-compact, cost effective end designs demanded by low-power IoT sensor networks. By integrating the Bluetooth low energy shield with the IDK, customers get a complementary choice of connectivity for extending reach, and sensing and actuator options, including lighting and motors.
The SPS shield extends the IDK to capture data from ON Semiconductor’s battery-free wireless sensors that measure temperature, moisture and pressure. The sensors are ideal for industrial and other applications with hard-to-access areas where zero maintenance is a necessity, and battery replacement is a challenge. Pairing the SPS shield with the IDK enables rapid prototyping of IoT applications that require battery-free sensing and wide-area or local connectivity and actuation options.
Both new shields expand the configurable, modular options for sensing, actuation and wired/wireless connectivity of the IDK, thereby giving application designers complete flexibility agnostic of the communication protocol chosen. They offer rapid and easy start-up of projects right out of the box, allowing developers to deliver data directly into the cloud, thereby enabling value-added services, including analytics.
IDK shields are supplied with full documentation including complete design schematics, PCB layouts and Gerber files to facilitate rapid transition of designs from concept, through development and into production. The industry standard interfaces ensure that current and future modules from ON Semiconductor and other vendors can be seamlessly integrated into designs while the simple ‘cut-and-paste’ approach to end product design reduces R&D time, expense and risk.
Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Touch-enabled 32-bit MCU EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Next-gen modules for rugged edge AI systems Altron Arrow
Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
Read more...Fanless multimedia edge PC Vepac Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...Fanless multimedia edge PC Future Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...A software-based controller for the industrial future Phoenix Contact
Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.
Read more...5G mobile hotspot with integrated multimodal AI capabilities CST Electronics
Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
Read more...Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...Panasonic TOUGHBOOK 33 2-in-1 detachable Vepac Electronics
Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.