Interconnection


Low-profile interconnect sockets

18 April 2018 Interconnection

Many of today’s products, such as implantable and wearable devices for the medical industry, demand miniaturisation along with high functionality and reliability.

Those requirements drive designers to find durable solutions to package more electronics into smaller spaces.

Addressing these needs, the new 315-43-1XX-41-004000 (single row) and 415-43-2XX-41-004000 (double row) sockets from Mill-Max have 2,54 mm pin spacing with a low profile of 2,11 mm. They are designed for through-hole mounting in boards up to 1,57 mm thick, providing a secure connection to the PCB.

These sockets are ideal for board stacking and wire-to-board applications where minimising package height is paramount. When mated with Mill-Max low-profile headers 335-10-1XX-00-160000 (single row) and 435-10-2XX-00-160000 (double row) the total between-boards height is only 3,94 mm. For wire-to-board connections the Mill-Max 380-10-1XX-00-002000 (single row) and 480-10-2XX-00-002000 (double row) solder cup headers combine with the low-profile sockets to achieve a total height of 6,81 mm.

Each receptacle is precision turned from brass alloy, has a highly reliable 4-finger, beryllium copper contact, accepts leads ranging from 0,38 to 0,56 mm, and is designed to withstand the rigors of rugged applications associated with portability. The insulator material is high-temperature PCT, compatible with most soldering processes. Connectors are available from 1 to 32 positions (single row) and 4 to 72 positions (double row). Standard plating options include tin or gold for the outer shell and gold for the internal contact, providing optimal interconnect reliability.



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