Manufacturing / Production Technology, Hardware & Services


Automated fluid dispensing platform

18 July 2018 Manufacturing / Production Technology, Hardware & Services

Nordson ASYMTEK’s Helios SD-960 series is a new automated dispensing system for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly.

The Helios system is ideal to deposit volumes greater than 1 cc, and line widths and dots that exceed 1 mm, but it can deposit volumes down to 0,3 cc and line widths as narrow as 0,3 mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies and grease for applications such as potting, sealing, gasketing and structural adhesives.

The system was made specifically to accommodate large parts and substrates.

The frame is 200 mm taller and the robotics 150 mm higher than a standard dispensing platform for more overhead clearance. An optional bulk fluid hose enclosure can provide added vertical clearance for securely routing remote bulk-feed hoses and to accommodate larger valves and mixers. There are two conveyor options: standard chain or double-wide chain. A large purge container holds volumes up to 2 litres.

Helios can be equipped with Nordson ASYMTEK dispense valves or Nordson 1k- or 2k-metering systems. When used with metering systems, the controls can be integrated so that the operator sees the metering system’s monitor from the same position as the machine control. This allows the operator to focus on the dispensing area during operation.

The Helios system comes with Nordson ASYMTEK’s Fluidmove software, providing dispense programming control in a familiar Windows environment. Closed-loop controls maintain control and accuracy of the dispensing process. An optional needle sensor is available to monitor the positioning of large needles that deliver bulk amounts and a laser height sensor automatically calibrates for substrate height.

A camera system enables programming and fiducial recognition, and an optional large-capacity, integrated weight scale provides mass flow calibration to ensure that dispense volumes remain within defined process limits through weight-controlled dispensing and automatic calibration.

The Helios system accommodates a variety of bulk fluid supply options. Various size reservoirs, fluid regulators, booster pumps, level sensors and more can be selected to fit the specific fluid and application requirements.

For more information contact Techmet, +27 11 824 1427, [email protected], www.techmet.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved