Infineon Technologies expanded its product portfolio of the thin-wafer technology TrenchStop 5 IGBT. The new product family offers up to a 40 A 650 V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 package (also known as D2PAK).
The new IGBT serves the growing demand for higher power density in power devices for automated surface mounted assembly. Typical applications are solar inverters, uninterruptible power supply (UPS), battery charging and energy storage.
The high power density of the new devices enables designers to upgrade existing designs, to develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs. The unique co-packed 40 A in D2PAK can be considered as an alternative to D3PAK or TO-247 used for surface mounting.
The new TrenchStop 5 650 V IGBT family comprises 15 A, 20 A, 30 A single IGBT and 15 A, 20 A, 30 A and 40 A IGBT co-packed with the same current freewheeling diode.
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