1 January 2019
Manufacturing / Production Technology, Hardware & Services
M8 no-clean solder paste from AIM is designed for the most demanding high-density electronic assemblies. An evolution of the highly successful NC258 platform and developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications.
A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates head-in-pillow defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. The paste leaves minimal, high-purity residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.
AIM solder pastes are produced from the highest quality, oxide-free powder manufactured to the Electropure specification. Solder pastes are manufactured in no-clean, water soluble and rosin based chemistries, and are available in all industry standard packaging.
September exclusives at PCBWay: Big savings on PCBs and 3D printing PCBWay
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[Sponsored] This September, PCBWay is bringing you two exciting, limited time offers that showcase both style and versatility. Whether you are designing with PCBs or prototyping with 3D printing, these will help you create more while spending less.
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