pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, announced the release of UltraCMOS 13.
The platform represents the next generation of the company’s proprietary RFSOI (RF silicon-on-insulator) technology, and builds on UltraCMOS 12 (introduced in January 2017), which exhibited a RONCOFF performance level of 80 fs. RONCOFF is a key performance metric of an RF switch, which is controlled to turn on (a resistor) or off (a capacitor). A low resistance (RON) reduces insertion loss and a low capacitance (COFF) increases isolation. In RF switching, performance is optimal when both metrics are as low as possible.
UltraCMOS 13 leverages enhanced RONCOFF and FMAX performance, enabling pSemi to deliver a differentiated RFIC portfolio. Initial product rollouts will target 5G-NR sub-6 GHz applications, including low-noise amplifiers (LNA), power amplifiers (PA) and switches.
The new 300 mm SOI platform features several additional advantages for superior RF performance, including ultra-low leakage FETs for PAs, lower NFMIN for LNAs, high-power handling for switches and optimised 1,2 V analog and digital support.
Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...Multi-channel cable assembly RFiber Solutions
Interconnection
Withwave’s Multi-Channel SMPM Cable Assemblies (WMCM Series) provide a wide range of multiple coax connectors and flexible cable assemblies, with a choice of 26,5, 40 and 50 GHz configurations.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
Read more...4G LTE-M/NB-IoT connectivity reference design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.
Read more...Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...Introducing SIMCom’s new A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.