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Vent panels for increased airflow and EMI protection
26 June 2019, Circuit & System Protection
Vent panels made by Laird Technologies offer effective ventilation within electronic equipment, while upholding signal integrity of the enclosure. Its MaxAir and ElectroVent solutions consist of layered, woven and crimped wire mesh for effective component cooling, combined with filtering media to help capture any contaminants that may disrupt ventilation and airflow to the application.
Each panel features EMI gaskets designed to prevent RF leakage and prevent signal migration to sensitive electronic equipment. They can be used for small enclosures, large housings, high-traffic areas and room-size facilities. A variety of plating and materials includes Monel, tin, copper, aluminium, brass and steel.
MaxAir is ideal for telecommunications hardware equipment such as fans, server racks and shielded rooms. Nickel and copper-plated polycarbonate honeycomb material and a frameless design allow for greater airflow through the entire honeycomb surface and greater EMI protection. It features easy press-to-fit assembly and increases useable airflow area by 10% to 20% compared to framed aluminium vent panels.
ElectroVent offers the designer versatility to meet EMI, environmental and mechanical requirements. For high-traffic areas, all EMI ventilation panels are available with a protective grille installed. Over 30 compounds available to ensure galvanic compatibility, and the materials are highly corrosion-resistant.
A variety of design specifications and mounting configurations are offered, with module construction available in assorted standard sizes from 19,35 to 111,13 cm². Pre-drilled holes or captive fasteners allow for quick mounting and removal. The panels are designed for an extended service life that exceeds the equipment they protect. |
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Further reading:
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