31 July 2019Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has introduced UL 94 V-0 antenna-grade laminates manufactured with standard profile electro-deposited copper foil to meet present and future performance requirements in active antenna arrays and small cells, specifically for IoT and 5G systems.
With the option of multiple copper foil offerings, design flexibility increases, and rounds out the performance versus cost portfolio.
The RO4730G3 ceramic hydrocarbon laminates were originally introduced with a standard profile, low-loss LoPro copper foil option. While LoPro copper foil provides excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) and has gained popularity for intermodulation (IM)-sensitive, high-frequency antennas, as 5G designs evolve, PIM has become less important in some applications. RO4730G3 laminates with standard profile electro-deposited copper provide an attractive blend of price, performance and durability.
These laminates provide a low dielectric constant (Dk) of 3,0 favoured by antenna designers, held to a tolerance of ±0,05 through the thickness (z-axis) when measured at 10 GHz. They are 30% lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques.
RO4730G3 circuit laminates exhibit a low z-axis coefficient of thermal expansion (CTE) of 30,3 ppm/°C from -55°C to +288°C for reliable plated through-holes (PTH) in multilayer circuit assemblies and are lead-free-process compatible.
For more information contact Andrew Hutton, RF Design, +27 21 555 8400, [email protected]
Why South African manufacturers must rethink device programming
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa positions itself as a fast-growing player in global electronics manufacturing, an often overlooked yet critical phase in the production lifecycle is coming into focus: device programming.
Read more...Energy harvesting and Matter for smarter homes RF Design
Power Electronics / Power Management
Qorvo’s collaboration with e-peas on the Matter Enabled Light Switch marks another significant step in advancing Matter adoption across the IoT industry.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...Why South African manufacturers must rethink device programming
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa positions itself as a fast-growing player in global electronics manufacturing, an often overlooked yet critical phase in the production lifecycle is coming into focus: device programming.
Read more...Wi-Fi 7 front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.
Read more...Find high-quality flex and rigid-flex PCBs at PCBWay PCBWay
Manufacturing / Production Technology, Hardware & Services
[Sponsored] Flex and rigid-flex PCBs are widely used across various industries due to their unique combination of flexibility, durability, and design versatility. Among the leading providers, PCBWay stands out for its exceptional quality services.
Read more...GNSS chipset for wearables RF Design
Telecoms, Datacoms, Wireless, IoT
The UBX-M10150-CC from u-blox is a GNSS chip that supports GPS, QZSS/SBAS, Galileo, and BeiDou constellations, and is designed for integration into wearable applications.
Read more...The ultimate range for design and repair RS South Africa
Manufacturing / Production Technology, Hardware & Services
Whether adapting existing systems or maintaining essential equipment, design and repair play a crucial role in ensuring efficiency and longevity.
Read more...Next-generation SPI and AOI series Techmet
Manufacturing / Production Technology, Hardware & Services
Saki Corporation has launched its next-gen series for SPI and AOI featuring a modular design for enhanced inspection efficiency and automation.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.