Manufacturing / Production Technology, Hardware & Services


Laminates for 5G active antenna arrays

31 July 2019 Manufacturing / Production Technology, Hardware & Services

Rogers Corporation has introduced UL 94 V-0 antenna-grade laminates manufactured with standard profile electro-deposited copper foil to meet present and future performance requirements in active antenna arrays and small cells, specifically for IoT and 5G systems.

With the option of multiple copper foil offerings, design flexibility increases, and rounds out the performance versus cost portfolio.

The RO4730G3 ceramic hydrocarbon laminates were originally introduced with a standard profile, low-loss LoPro copper foil option. While LoPro copper foil provides excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) and has gained popularity for intermodulation (IM)-sensitive, high-frequency antennas, as 5G designs evolve, PIM has become less important in some applications. RO4730G3 laminates with standard profile electro-deposited copper provide an attractive blend of price, performance and durability.

These laminates provide a low dielectric constant (Dk) of 3,0 favoured by antenna designers, held to a tolerance of ±0,05 through the thickness (z-axis) when measured at 10 GHz. They are 30% lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques.

RO4730G3 circuit laminates exhibit a low z-axis coefficient of thermal expansion (CTE) of 30,3 ppm/°C from -55°C to +288°C for reliable plated through-holes (PTH) in multilayer circuit assemblies and are lead-free-process compatible.

For more information contact Andrew Hutton, RF Design, +27 21 555 8400, andrew@rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

RF fixed chip attenuators
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT
The TT5 Series from Smiths Interconnect are Q-band chip attenuators that operate from DC to 18 GHz. The broadband attenuators are available in attenuation values from 0 to 20 dB in 0,5 dB increments and ...

Read more...
RF variable attenuator
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT
The 4209-30-63-1 from API Technologies - Weinschel is a solid-state programmable attenuator that operates from 0,1 to 30 GHz. It has an attenuation range from 0 to 63 dB with a step size of 0,5 dB and ...

Read more...
Wideband GaN power amplifier
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT
Qorvo introduced what it claims is the world’s highest-performance wideband power amplifier (PA). Designed for electronic warfare, radar and test instrumentation applications, the TGA2962 boasts 10 W ...

Read more...
High-performance IoT SoCs with dual processors
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT, Editor's Choice
Nordic Semiconductor’s new nRF5340 high-end multiprotocol system-on-chip (SoC) is the first member of its next generation of nRF5 Series SoCs. The nRF5340 builds on Nordic’s proven and globally adopted ...

Read more...
IP67 rated antenna for all cellular bands
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT
The Taoglas GSA.8835 is a fully IP67-rated waterproof 5G/4G external adhesive-mount antenna designed for use with all cellular modules worldwide, including new 5G bands. With extended wideband cellular ...

Read more...
28 GHz bandpass filter for mm-Wave
29 January 2020, RF Design , Passive Components
The B274MB1S from Knowles is a bandpass filter with a passband from 26,5 to 29,5 GHz, ideally suited for 5G mm-Wave applications. It has an insertion loss of less than 3,5 dB and a rejection of 40 dB ...

Read more...
Class AB RF amplifiers with optional heatsinks
29 January 2020, RF Design , Telecoms, Datacoms, Wireless, IoT
Pasternack has launched a new series of high-power, Class AB broadband amplifier modules that incorporate GaN, LDMOS or VDMOS semiconductor technology. The combination of high linearity and efficiency ...

Read more...
High-voltage moulded power inductors
29 January 2020, RF Design , Passive Components
Coilcraft has expanded its XEL family of high-performance, moulded power inductors to include three new higher-voltage series: the XEL401xV, XEL4020V and XEL4030V. All three offer operating voltage ratings ...

Read more...
DC-22 GHz MMIC amplifier
25 November 2019, RF Design , Telecoms, Datacoms, Wireless, IoT
The CMD284P4 from Custom MMIC is a wideband GaAs MMIC distributed amplifier housed in a leadless 4x4 mm plastic surface mount package. Suitable for S, C, X, Ku and K-band operation, the amplifier operates ...

Read more...
Automotive Bluetooth and Wi-Fi modules
25 November 2019, RF Design , Telecoms, Datacoms, Wireless, IoT
The JODY-W2 series from u-blox are automotive-grade RF modules supporting dual-band Wi-Fi 802.11a/b/g/n/ac and dual-mode Bluetooth 5 (Bluetooth BR/EDR and Low Energy). These compact modules are based ...

Read more...