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Laminates for 5G active antenna arrays
31 July 2019, Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has introduced UL 94 V-0 antenna-grade laminates manufactured with standard profile electro-deposited copper foil to meet present and future performance requirements in active antenna arrays and small cells, specifically for IoT and 5G systems.
With the option of multiple copper foil offerings, design flexibility increases, and rounds out the performance versus cost portfolio.
The RO4730G3 ceramic hydrocarbon laminates were originally introduced with a standard profile, low-loss LoPro copper foil option. While LoPro copper foil provides excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) and has gained popularity for intermodulation (IM)-sensitive, high-frequency antennas, as 5G designs evolve, PIM has become less important in some applications. RO4730G3 laminates with standard profile electro-deposited copper provide an attractive blend of price, performance and durability.
These laminates provide a low dielectric constant (Dk) of 3,0 favoured by antenna designers, held to a tolerance of ±0,05 through the thickness (z-axis) when measured at 10 GHz. They are 30% lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques.
RO4730G3 circuit laminates exhibit a low z-axis coefficient of thermal expansion (CTE) of 30,3 ppm/°C from -55°C to +288°C for reliable plated through-holes (PTH) in multilayer circuit assemblies and are lead-free-process compatible.
For more information contact Andrew Hutton, RF Design, +27 21 555 8400, andrew@rfdesign.co.za |
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