New revision of COM Express specification
27 June 2012
News
PICMG, a leading standards organisation for the communications, military and embedded computer industries, has announced the adoption and availability of the COM Express Revision 2.1 specification.
The original computer-on-module (COM) Express specification, adopted by PICMG in 2005, was designed to reduce time-to-market on specialised platforms used in industrial, medical, military, scientific and telecommunication applications. COM Express puts all compute functions on small modules that can be used standalone or plugged onto a base board with application-specific I/O.
The COM Express Revision 2.1 specification allows developers to focus on their specialised I/O requirements, without concern for the complex interactions of CPUs, RAM, chipsets and other basic elements that occur on the module. This revision adds new features and module sizes, and helps ensure that COM Express modules are prepared for future processors and high-speed I/O evolution, while accommodating backward compatibility with older modules.
Significant enhancements include standardisation of new and smaller module sizes, extended power supply range, latest graphics interface support, USB 3.0 support and CAN-bus support.
The new specification is available in print and electronic formats, and can be purchased at www.picmg.org/v2internal/specorderformsec.htm
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version