New revision of COM Express specification
27 June 2012
News
PICMG, a leading standards organisation for the communications, military and embedded computer industries, has announced the adoption and availability of the COM Express Revision 2.1 specification.
The original computer-on-module (COM) Express specification, adopted by PICMG in 2005, was designed to reduce time-to-market on specialised platforms used in industrial, medical, military, scientific and telecommunication applications. COM Express puts all compute functions on small modules that can be used standalone or plugged onto a base board with application-specific I/O.
The COM Express Revision 2.1 specification allows developers to focus on their specialised I/O requirements, without concern for the complex interactions of CPUs, RAM, chipsets and other basic elements that occur on the module. This revision adds new features and module sizes, and helps ensure that COM Express modules are prepared for future processors and high-speed I/O evolution, while accommodating backward compatibility with older modules.
Significant enhancements include standardisation of new and smaller module sizes, extended power supply range, latest graphics interface support, USB 3.0 support and CAN-bus support.
The new specification is available in print and electronic formats, and can be purchased at www.picmg.org/v2internal/specorderformsec.htm
Further reading:
SACEEC celebrates standout industrial innovation on the KITE 2025 show floor
News
Exhibitor innovation took the spotlight at the KITE 2025 as the South African Capital Equipment Export Council announced the winners of its prestigious New Product & Innovation Awards.
Read more...
SA team for International Olympiad in Informatics
News
The Institute of Information Technology Professionals South Africa has named the team that will represent South Africa at this year’s International Olympiad in Informatics.
Read more...
Anritsu and Bluetest to support OTA measurement
News
Anritsu Company and Sweden-based Bluetest AB have jointly developed an Over-The-Air measurement solution to evaluate the performance of 5G IoT devices compliant with the RedCap specification.
Read more...
The current sentiment of the global electronics manufacturing supply chain
News
In its latest report, the Global Electronics Association provides an analysis of the current sentiment and conditions in the global electronics manufacturing supply chain as of June 2025.
Read more...
Global semiconductor sales increase in May
News
The Semiconductor Industry Association recently announced global semiconductor sales were $59,0 billion during the month of May 2025, an increase of 19,8%.
Read more...
New president for Avnet EMEA
News
Avnet has announced that Avnet Silica’s president, Gilles Beltran, will step into the role of president of Avnet EMEA.
Read more...
DARPA sets new record for wireless power beaming
News
In tests performed in New Mexico, the Persistent Optical Wireless Energy Relay program team recorded over 800 W of power delivered for about 30 seconds with a laser beam crossing 8,6 kilometres.
Read more...
Nordic Semiconductor acquires Memfault
RF Design
News
With this acquisition, Nordic has launched its first complete chip-to-cloud platform for lifecycle management of connected products.
Read more...
Trina storage demonstrates high efficiency and long-term reliability
News
Independent testing confirms 95,2% DC efficiency and 98% capacity retention after one year of operation.
Read more...
From the editor's desk: AI – a double-edged sword
Technews Publishing
News
As with any powerful tool, AI presents challenges, some of which, if not carefully managed, threaten to undo the potential that it can offer.
Read more...
printer friendly version