Significant technical updates, greater ease-of-use and compatibility with other key assembly standards are among the many changes users will find in the newly released B revision of IPC/WHMA-A-620 ‘Requirements and Acceptance for Cable and Wire Harness Assemblies’. This industry standard is a joint effort of IPC and the Wire Harness Manufacturer’s Association (WHMA).
The revision addresses more than 500 documented comments and recommendations from users throughout the industry and features 125 new or changed illustrations.
Some of the most extensive changes appear in the moulding and potting section, which has been expanded for increased coverage of Class 2 and 3 requirements, including 31 new illustrations. The document also provides new criteria for wires as small as #32 AWG, and has a section on requirements flow-down, which requires companies to have their subcontractors use the standard to ensure all hardware is manufactured to the same guidelines.
In addition, the revised document allows users to more easily reference and apply criteria from multiple standards, thanks to greater compatibility with the widely used J-STD-001E ‘Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610E, Acceptability of Electronic Assemblies’.
Users with varying reliability requirements and markets in different regions will also have greater ease-of-use with the addition of UL, SAE and IEC pull-force tables.
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...Siemens acquires Canopus AI ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.