Events


Webinar: Low-Temperature Solder Benefits and Process Concerns

23 October 2019 Events

When: 11 November 2019 from 2:30 to 4:00 pm (UK time).

Duration: Between 60 and 90 minutes,including question and answer session.

Cost: £65

Register: www.bobwillis.co.uk/event/low-temperature-solder-benefits-process-concerns/

The use of low-temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage, and improve reliability. It is different but that does not mean it cannot be introduced into your process with existing process equipment. Many companies have been using tin/bismuth alloys for some years, reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive, provided you consider the total cost of manufacture.

In his webinar entitled ‘Low-Temperature Solder Benefits and Process Concerns’, Bob Willis will address these issues by covering topics such as why you should use low-temperature solder, its benefits over lead-free alloys, materials available, reflow soldering and rework results, selective soldering, reliability with mixed alloys, and inspection results.

The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.http://www.bobwillis.co.uk




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