Xilinx began shipping Versal AI Core series and Versal Prime series devices to multiple tier-one customers. Versal is the industry’s first adaptive compute acceleration platform (ACAP), a new category of heterogeneous compute devices with capabilities that exceed those of conventional CPUs, GPUs and FPGAs.
An ACAP is a highly integrated, multicore, heterogeneous compute platform that can be changed at both the hardware and software levels to dynamically adapt to the needs of a wide range of applications and workloads in data centre, automotive, 5G wireless, wired and defence markets.
Built from the ground up to be natively software programmable, the Versal ACAP architecture features a flexible, multi-terabit-per-second network-on-chip (NoC). The NoC seamlessly integrates all engines and key interfaces, making the platform available at boot and easily programmed by software developers, data scientists and hardware developers alike.
Through a host of tools, software, libraries, IP, middleware and frameworks, ACAPs enable dynamically customisable accelerated computing solutions through industry-standard design flows.
NXP further expands LPC5500 MCU family 25 November 2019, EBV Electrolink
, DSP, Micros & Memory
NXP Semiconductors announced the availability of its LPC552x/S2x microcontroller (MCU) family, further extending its efficient LPC5500 MCU series with the second of seven families planned for the series. ...
Read more...Fully integrated power management IC 25 November 2019, EBV Electrolink
, Power Electronics / Power Management
With features including four DC-DC buck converters, a boost DC-DC converter, and six low-dropout regulators (LDOs), the STMicroelectronics STPMIC1 power management IC (PMIC) satisfies the complex power ...
Read more...STM8 development boards in Nucleo-32 format 25 November 2019, EBV Electrolink
, Design Automation
STMicroelectronics is making design starts using 8-bit STM8 microcontrollers (MCUs) faster, more affordable, and more accessible by introducing new development boards in the Nucleo-32 form factor.
The ...
Read more...Radiation-tolerant PolarFire FPGA 23 October 2019, Avnet South Africa
, Programmable Logic
Developers of spacecraft electronics use radiation-tolerant (RT) field programmable gate arrays (FPGAs) to create on-board systems that meet the demanding performance needs of future space missions, survive ...
Read more...Radiation-tolerant PolarFire FPGA 25 November 2019, Avnet South Africa
, Programmable Logic
Developers of spacecraft electronics use radiation-tolerant (RT) field programmable gate arrays (FPGAs) to create on-board systems that meet the demanding performance needs of future space missions, survive ...
Read more...Smart meter chipset with RF and power-line comms 25 November 2019, EBV Electrolink
, Telecoms, Datacoms, Wireless, IoT
STMicroelectronics is facilitating smarter city and industry infrastructures through the combination of powerline and wireless communication in its market-proven smart meter chipset.
Already widely used ...
Read more...Safe, real-time automotive MCUs 25 November 2019, EBV Electrolink
, DSP, Micros & Memory
STMicroelectronics advanced safer, smarter automotive electronics and domain controllers with the introduction of its Stellar automotive microcontroller (MCU) family. The Stellar MCUs support next-generation ...
Read more...Lattice AI stack for edge devices 25 November 2019, Future Electronics
, Programmable Logic
Lattice Semiconductor received a number of industry awards for sensAI – a complete technology stack combining modular hardware kits, neural network IP cores, software tools, reference designs and custom ...
Read more...STMicro shows full power of Bluetooth mesh 25 November 2019, EBV Electrolink
, Telecoms, Datacoms, Wireless, IoT
With the release of Bluetooth mesh software stacks for the BlueNRG family of Bluetooth Low Energy chips and modules, STMicroelectronics demonstrates the many capabilities of Bluetooth mesh networks enabled ...
Read more...System-on-chip solution for payments 25 November 2019, EBV Electrolink
, Analogue, Mixed Signal, LSI
Filename: kt0747.docx
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e-Section: AML
online credits: EBV
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Title: System-on-chip solution for payments
Body:
STMicroelectronics has released ...
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