Xilinx began shipping Versal AI Core series and Versal Prime series devices to multiple tier-one customers. Versal is the industry’s first adaptive compute acceleration platform (ACAP), a new category of heterogeneous compute devices with capabilities that exceed those of conventional CPUs, GPUs and FPGAs.
An ACAP is a highly integrated, multicore, heterogeneous compute platform that can be changed at both the hardware and software levels to dynamically adapt to the needs of a wide range of applications and workloads in data centre, automotive, 5G wireless, wired and defence markets.
Built from the ground up to be natively software programmable, the Versal ACAP architecture features a flexible, multi-terabit-per-second network-on-chip (NoC). The NoC seamlessly integrates all engines and key interfaces, making the platform available at boot and easily programmed by software developers, data scientists and hardware developers alike.
Through a host of tools, software, libraries, IP, middleware and frameworks, ACAPs enable dynamically customisable accelerated computing solutions through industry-standard design flows.
New high current through-hole inductors EBV Electrolink
Passive Components
Vishay has released a high current, through-hole inductor for use in high current and high temperature applications, DC/DC converters, high current differential chokes and inverters.
Read more...Samsung launches GDDR6 RAM module EBV Electrolink
Computer/Embedded Technology
The DRAM is capable of 24 Gbps processing speeds and will significantly advance the graphics performance of AI-based applications and high-performance computing.
Read more...SolidRun releases a SoM solution based on a Renesas SoC EBV Electrolink
DSP, Micros & Memory
In partnership with Renesas, SolidRun has released a SoM solution based on the powerful RZ/G2 family of SoCs, which are engineered for AI-enhanced HMI applications.
Read more...Programmable Bluetooth low-energy wireless SoC EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The next-gen BlueNRG-LPS SoC, a Bluetooth low-energy 5.3 enabled device, can precisely estimate movement and location with centimetre accuracy.
Read more...Mastering the MicroBlaze processor EBV Electrolink
DSP, Micros & Memory
AMD-Xilinx and Adiuvo will present a hands-on workshop on using the MicroBlaze processor on the Spartan-7 evaluation kit to create, develop and deploy an FPGA solution.
Read more...Low power 36 V operational amplifier EBV Electrolink
Analogue, Mixed Signal, LSI
The TSB622 is a general-purpose, dual operational amplifier featuring an extended supply voltage operating range of 2,7 to 36 V and rail-to-rail output
Read more...Embedded voice control via the STM32Cube EBV Electrolink
DSP, Micros & Memory
STMicroelectronics and Sensory collaborate to enable mass-market adoption of embedded voice control through the STM32Cube software ecosystem.
Read more...Digital ambient light sensor EBV Electrolink
Opto-Electronics
The device is a highly sensitive light-to-digital converter that transforms light intensity into a digital signal output through an I2C digital interface.
printer friendly version