Computer/Embedded Technology


Solderless robotics kit for university education

1 November 2019 Computer/Embedded Technology

Texas Instruments introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test. Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes. Classrooms that may not have access to soldering equipment can benefit from the solderless, hands-on kit and curriculum that can be reused year after year.

TI launched the TI-RSLK series last year to help universities across the globe keep students engaged from their first day of class until graduation with hands-on, customisable options for learning embedded systems design. The TI-RSLK MAX completes all tasks and robotic challenges covered in the previous TI-RSLK Maze Edition kit, such as solving a maze, line following and avoiding obstacles. It also provides a user-friendly assembly of the various sub-systems, speeding up the building and testing of the robot.

The new kit includes the SimpleLink MSP432P401R microcontroller (MCU) LaunchPad development kit, easy-to-connect sensors, and a versatile chassis board that turns the robot into a mobile learning platform. Through an accompanying core and supplemental curriculum, students learn how to integrate their hardware and software knowledge to build and test a system. For advanced learning, wireless communication and Internet of Things (IoT) capabilities can be added to the TI-RSLK MAX to remotely control the robot or even establish robot-to robot communication.


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