Solderless robotics kit for university education

1 November 2019 Computer/Embedded Technology

Texas Instruments introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test. Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes. Classrooms that may not have access to soldering equipment can benefit from the solderless, hands-on kit and curriculum that can be reused year after year.

TI launched the TI-RSLK series last year to help universities across the globe keep students engaged from their first day of class until graduation with hands-on, customisable options for learning embedded systems design. The TI-RSLK MAX completes all tasks and robotic challenges covered in the previous TI-RSLK Maze Edition kit, such as solving a maze, line following and avoiding obstacles. It also provides a user-friendly assembly of the various sub-systems, speeding up the building and testing of the robot.

The new kit includes the SimpleLink MSP432P401R microcontroller (MCU) LaunchPad development kit, easy-to-connect sensors, and a versatile chassis board that turns the robot into a mobile learning platform. Through an accompanying core and supplemental curriculum, students learn how to integrate their hardware and software knowledge to build and test a system. For advanced learning, wireless communication and Internet of Things (IoT) capabilities can be added to the TI-RSLK MAX to remotely control the robot or even establish robot-to robot communication.

Further reading:

Rugged, I/O-rich NVIDIA Jetson solutions
Electronic Products Design Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.

Read more...

---

New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.

Read more...

---

Smallest 13th gen Intel SBC
Vepac Electronics Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.

Read more...

---

Versatile PoE extender
Vepac Electronics Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.

Read more...

---

First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...

---

QuecPi smart development board
iCorp Technologies Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.

Read more...

---

Eskom announces PV registration extension
Computer/Embedded Technology
The South African Photovoltaic Industry Association has welcomed Eskom’s decision to extend its zero-registration fee policy and free smart meter installation for residential Small-Scale Embedded Generation customers until March 2026.

Read more...

---

Unlock enhanced wireless performance
Computer/Embedded Technology
Duxbury Networking has introduced Cambium Networks’ Deep Virtual Circuit (Deep VC) technology, a free upgrade for the PMP 450 platform that will transform wireless broadband performance across the country.

Read more...

---

Computing in industrial environments
Vepac Electronics Computer/Embedded Technology
The Panasonic Toughbook CF-33/CF33 Tablet is a 12,0-inch fully rugged device with hot-swappable twin batteries and highly configurable capabilities.

Read more...

---

DDR5 DRAM series
Vepac Electronics Computer/Embedded Technology
Innodisk has announced its DDR5 6400 DRAM series featuring the industry’s largest 64GB single-module capacity.

Read more...

---