DSP, Micros & Memory


32-bit Arm microcontrollers

29 January 2020 DSP, Micros & Memory

Renesas Electronics unveiled the Renesas Advanced (RA) family of 32-bit Arm Cortex-M microcontrollers (MCUs).

They deliver a combination of optimised performance, security, connectivity, peripheral IP, and easy-to-use flexible software package (FSP) to address the next generation of embedded solutions. To support the new family, Renesas has built a comprehensive partner ecosystem to deliver an array of software and hardware building blocks that will work out of the box with RA MCUs.

The RA family ecosystem will help accelerate the development of IoT applications with core technologies such as security, safety, connectivity and HMI. Designing with RA MCUs makes it easy for engineers to develop Internet of Things (IoT) endpoint and edge devices for industrial and building automation, metering, healthcare, and home appliance applications. The RA family is PSA Certified Level 1 and includes the RA2 series (up to 60 MHz), RA4 series (up to 100 MHz), RA6 series (up to 200 MHz), and the dual-core RA8 Series, to be released later.

The first five RA MCU groups available are comprised of 32 scalable MCUs with Arm Cortex-M4 and Cortex-M23 processor cores. They feature pin counts of 32 pins to 176 pins, along with 256 KB to 2 MB of code Flash memory, 32 KB to 640 KB SRAM, and connectivity such as USB, CAN and Ethernet. It is easy to transition within the RA family thanks to feature and pin compatibility. Each RA MCU group provides low active and standby power, and enhanced features such as Renesas’ popular HMI capacitive touch technology.

The RA Family FSP provides an open architecture that allows customers to reuse their legacy code and combine it with software examples from Renesas and ecosystem partners to speed implementation of complex functions like connectivity and security. The FSP features Amazon FreeRTOS and will also add out-of-box support for ThreadX RTOS and middleware on Cortex-M23 and Cortex-M33 MCUs by early 2020, offering a premium device-to-cloud option for developers. These out-of-box options can be easily replaced and expanded with any other RTOS or middleware.

For more information contact Jody Botha, Hi-Q Electronics, +27 11 894 8083, jody@hi-q.co.za, www.hi-q.co.za


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Smallest automotive maXTouch controllers
29 July 2020, Altron Arrow, Avnet Silica , DSP, Micros & Memory
To help enhance and ease today’s driving experience, automotive manufacturers are implementing additional touch displays beyond the centre infotainment display (CID). Supporting the application of these ...

Read more...
New low-power MCU from Renesas
29 July 2020, Hi-Q Electronics , DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...

Read more...
Diodes for RF/microwave applications
30 June 2020, Hi-Q Electronics , Telecoms, Datacoms, Wireless, IoT
Skyworks’ broad portfolio of PIN, limiter, Schottky, and varactor diodes are ideal for WLAN, infrastructure, handset, Satcom (LNB/DBS-CATV), automotive, aerospace and defence, test and measurement, metering, ...

Read more...
New low-power MCU from Renesas
30 June 2020, Hi-Q Electronics , DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...

Read more...
MCUs for precision sensing and measurement
29 July 2020, RS Components (SA) , DSP, Micros & Memory
A new series of single-chip devices from Renesas, the RX23E-A microcontrollers (MCUs), combine an analog front end (AFE) and an MCU core for use in equipment that delivers high-precision measurements ...

Read more...
Sensor signal conditioning IC
30 June 2020, Hi-Q Electronics , Analogue, Mixed Signal, LSI
New from Renesas Electronics is the ZSSC3240 sensor signal conditioner (SSC) – the newest member of its leading-edge SSC portfolio. The ZSSC3240 delivers high accuracy, sensitivity and flexibility for ...

Read more...
Industrial-grade 32 GB DRAM modules
29 May 2020, Vepac Electronics , DSP, Micros & Memory
32 GB DRAM modules from Innodisk are the newest industrial-grade, high-capacity DRAM series launched with expanded capacity. Targeted at core network switches for 5G technology – touted as a much faster, ...

Read more...
Microcontrollers for functional safety
29 May 2020, Avnet Silica , DSP, Micros & Memory
As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers ...

Read more...
Enabling cloud connectivity to all Microchip MCUs and MPUs
25 March 2020, Avnet Silica , DSP, Micros & Memory
Due to the fragmented nature of the Internet of Things (IoT) marketplace, increasing project complexity and costs, today’s developers face more challenges in design decisions than ever before. These challenges ...

Read more...
High-speed DDR4 SDRAMs
29 April 2020, Future Electronics , DSP, Micros & Memory
Alliance Memory has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4 GB AS4C256M16D4 and AS4C512M8D4 ...

Read more...