Osram Opto Semiconductors used its advanced illumination technology on the 'Mighty F-350 Tonka' concept vehicle, one of the featured vehicles at the 2002 Chicago Auto Show in February. The Mighty F-350 Tonka is the first Ford truck to be fully equipped with Osram OS high-flux Power TOPLED products throughout the vehicle's interior and exterior: low beam headlamps, fog lamps, running board lamps, signal lamps including the rear combination lamps (RCL), center high mount stop lamps (CHMSL) and back-up lamps.
Developed in 1998, Power TOPLED is exceptionally compact, and the first high-brightness surface mountable LED to be applied to automotive exterior lighting. LED technology provides multiple advantages over incandescent lighting, ranging from reduced power, improved reliability, more compact packaging and more flexible optical designs. LEDs are more efficient than incandescent lighting, reducing power consumption by 50%.
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...Siemens acquires Canopus AI ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.