High-temperature electronics offers the automotive industry enormous potential benefits in terms of efficiency, cost and emissions. According to the HITEN report released in 2000 by the High-temperature Electronics Network (HITEN), the world market for high-temperature electronics is expected to more than double, from $177m in 1998 to $377m in 2003, and keep growing to $887m by the year 2008.
The automotive industry and the oil/gas prospecting equipment industry are the two major fields of application for high-temperature electronics today. As its importance to the automotive industry keeps increasing, motor vehicles will account for two-thirds of the total HITEN market by 2008, according to the report.
In the automotive industry, applications for high-temperature electronics are driven by customer demands for greater safety, security and convenience as well as by legal and political requirements for more efficient and environmentally friendlier vehicles. The industry urgently needs electronic systems capable of working under harsh ambient conditions at temperatures up to 175°C or higher. But current standards for automotive electronic components specific a maximum ambient temperature of only 125°C.
With financial support from the European Commission, 12 European organisations in six countries have launched a research project known as PROCURE (program for development of passive components used in rough environments). PROCURE focuses on materials, processes, and prototypes of components for the next generation of electronic control units and system architectures operating in harsh environments. Extended service life as well as high-temperature operation at 150, 175 and even 225°C are the overriding design goals.
As well as research bodies, representatives of the automotive industry such as DaimlerChrysler and components manufacturers such as Epcos are involved in the project.
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...Siemens acquires Canopus AI ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version