Single/multilayer high-density thin-film interconnects integrate conductor patterns and other passive components in custom resistor solutions

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9 April 2003 Passive Components

Vishay Intertechnology has announced the release of new thin-film, single- and multilayer high-density interconnects (HDIs), low-noise products with enhanced signal routing and response conditioning that integrate conductor patterns and other passive components in custom resistor solutions.

Each of these patterned, thin-film substrates is designed by Vishay Electro-Films (EFI) with the customer, the two working as a team to develop application-specific solutions for use in microwave circuitry and hybrid circuitry in high-performance, low-noise power amplifiers; avionics; satellites; and medical instrumentation. Because of the high complexity of these devices and their close relationship to end-product performance, this team-oriented approach ensures the optimum ratio of price to performance according to the company.

Vishay EFI has had distinctive success in developing and manufacturing rugged and well-defined air bridges down to a 0,0254 mm width with consistent air-gap dimensions. Because multilayer HDIs are built up rather than out, they are capable of integrating a greater number of components into a much smaller footprint. Dimensions for each device may be as small as 0,508 by 0,508 mm or as large as 101,6 by 101,6 mm, with thickness ranging from 0,127 to 0,127 mm.

The new HDIs may be manufactured in designs of up to five layers and with special shapes, vias, and patterns. Each is available with a nichrome or tantalum nitride resistor element and in a wide variety of materials and conductor and adhesion metals. Additional options include metallised through-holes, backside metallising and patterning, wrap-around patterned edges, thick copper power line conductors, filled vias for added low-thermal-conductivity paths to a ground plate heat sink, and both aluminium and gold wire bond pads on the same substrate to provide monometallic interfaces in very-high-temperature applications. Multilevel metallisation is achieved using polyimide insulation. Available substrates are alumina (Al2O3), beryllium oxide (BeO), aluminium nitride (AlN), quartz, and silicon.

To obtain a quotation, e-mail drawings or requirements to [email protected] or see www.vishay.com.

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Single/multilayer high-density thin-film interconnects integrate conductor patterns and other passive components in custom resistor solutions

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