Poynting Innovations receives SPII Award
22 October 2003
News
At the 2003 Support Programme for Industrial Innovation (SPII) awards ceremony, Poynting Innovations received a prestigious award presented by the Department of Trade and Industry in recognition of outstanding innovation. Ten companies were selected from more than 54 projects that were evaluated.
The SPII Awards acknowledge the exceptional achievements of entrepreneurs who turn innovative ideas into commercially successful businesses. Minister of Trade and Industry, Alec Irwin, presented Poynting with this award for its patented SIP (solder in plastic) process (pictured).
The SIP method involves the use of a plastic moulded item with an antenna artwork (represented by channels) on the surface of the plastic. The SIP process involves a special-purpose machine with a closing plate that is pushed against the plastic item to close off the channels. Molten solder is then injected into these channels to form the antenna and its feed network in a single low cost mass production process. The cost of producing a SIP item is about one tenth of the cost of an equivalent printed circuit board. In principle, SIP could replace PCB components in antennas entirely and reduce costs considerably just by doing so.
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