Memec to distribute TransDimension USB profucts
25 February 2004
News
Insight Memec, the global semiconductor distributor and subsidiary of The Memec Group, has been engaged by TransDimension, of Irvine, California, to provide technical sales and distribution/logistical support in Europe.
A leading provider of USB connectivity solutions for embedded applications, TransDimension says it has expanded its European market presence in response to significant market acceptance of its USB connectivity semiconductor and software solutions.
"Insight Memec brings world class semiconductor demand creation, technical support, logistics, and customer relationships that allow us to better service our European customers' growing need for embedded USB solutions," said Mike Holt, TransDimension vice president of marketing and business operations. "We are excited to have Insight Memec as our Pan-European distributor."
TransDimension's product lines include ICs (semiconductors), IP cores, and software that provide direct connectivity for a wide range of PC peripheral, consumer and mobile devices. Until now, these applications have required an indirect means, such as a PC host, to exchange data. These embedded applications include cellphones, set top boxes, printers, CD, DVD and MP3 players, digital cameras and portable storage products.
"TransDimension is at the forefront of USB/OTG connectivity, offering complete USB solutions to both hardware and software," commented Bill Walker, president, Insight Memec Europe. "Adding TransDimension to our portfolio strengthens our commitment to provide innovative solutions to the increasing requirements of both consumer and industrial markets in Europe. Insight Memec looks forward to distributing and providing technical sales support to TransDimension's USB product line."
For more information contact Memec SA, 011 897 8600.
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version