Giving a voice to the speechless
30 April 2008
News
A company called Ambient Corporation recently gave the first live demonstration of how its new technology, the Audeo, which will enable voiceless communication either face-to-face or via phone. The Audeo, based on ultra-low power MSP430 microcontroller (MCU) technology from Texas Instruments, is expected to offer life-changing options for people who have lost the ability to move or speak due to neurological disorders, Lou Gehrig's Disease (Amyotrophic Lateral Sclerosis), traumatic brain injury, cerebral palsy or Parkinson's.
A company called Ambient Corporation recently gave the first live demonstration of how its new technology, the Audeo, which will enable voiceless communication either face-to-face or via phone. The Audeo, based on ultra-low power MSP430 microcontroller (MCU) technology from Texas Instruments, is expected to offer life-changing options for people who have lost the ability to move or speak due to neurological disorders, Lou Gehrig's Disease (Amyotrophic Lateral Sclerosis), traumatic brain injury, cerebral palsy or Parkinson's.
"The Audeo can enable voiceless communication that is virtually as easy as just thinking about it," said Michael Callahan, Ambient's CEO and co-founder. "Historically, every time it becomes easier for people to communicate, people become more connected and the interactions enrich people's lives. It is our hope that the Audeo will allow many more profound ideas to change the world through communication."
The Audeo is a wireless sensor worn on the neck to capture neurological activity that the brain sends to the vocal cords, and then digitises this activity using analog and digital technology to convert it into speech. Thanks to the low power consumption of the MSP430 MCUs, the Audeo can last over eight hours on a single charge, giving people the ability to interact with their world knowing they will be able to communicate.
During a keynote presentation at the Texas Instruments Developer Conference (TIDC), Callahan demonstrated this technology by using the Audeo to place the world's first, voiceless cellphone call to Mike Hames, TI's senior vice president of Application Specific Products (ASP). The Audeo takes information gathered from the sensor worn on the neck and sends this information to a mobile phone using Bluetooth wireless technology.
For more information visit www.theaudeo.com
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version