New revision for BGA assembly standard
14 May 2008
News
The IPC has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs.
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents unique challenges for design, assembly, inspection and repair personnel, especially in light of recent changes in alloys and surface finishes. IPC-7095B offers practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.
"The B revision of IPC-7095 was released at APEX in Vegas with 100% approval of voting members, which is an extraordinary achievement and a great tribute to the hard work of the committee," says Ray Prasad, principal of Ray Prasad Consultancy Group and committee chair.
"This version focuses on the design and assembly issues of lead-free BGAs along with applications that use both tin-lead and lead-free on the same board, including various solder ball alloys, new laminate materials for lead-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost," adds Prasad. "There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability."
For more information visit www.ipc.org
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