New IPC standard released

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1 October 2008 News

The IPC has announced the release of J-STD-075, 'Classification of Non-IC Electronic Components for Assembly Processes'. Developed jointly by IPC, JEDEC and ECA (Electronic Components Association), this new document expands on existing standards to provide test methods and classification levels to identify the worst-case thermal process limitations for all electronic components that may be processed as part of a circuit card assembly, including passives, connectors, switches and other devices.

“Users have long been struggling with component damage that occurs during processing,” said Jack Crawford, IPC director of certification and assembly technology. “J-STD-075 provides classifications to cover the increased preheat, reflow or wave soldering temperatures that can cause components to melt, warp, crack, delaminate or even explode. Another potential source of damage involves cleaning processes.”

According to Crawford, J-STD-020, 'Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices' is limited to moisture-related issues of nonhermetic integrated circuits. “The new standard expands the coverage to all components,” he adds.

Additionally, J-STD-075 includes classification categories to identify cleaning process sensitivity. There is also a wild card option that component manufacturers can use to identify process issues not covered by this standard. J-STD-075 references the packaging and labelling requirements of J-STD-033, 'Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices'. J-STD-075 supersedes IPC-9503.

For more information contact Jack Crawford, IPC, [email protected]

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