Intel sends young SA scientists to US
21 January 2009
News
Four students who recently won gold medals at the Eskom Expo for Young Scientists, will be sent by Intel to the 2009 Intel International Science and Engineering Fair (ISEF) in the US where they will compete at international level. The students are Christopher Wiken, Jacques Winterbach, Arno de Beer and Jason Dixon.
The expo, held at the University of Pretoria in October this year, saw learners from 26 regions take part by exhibiting more than 460 science projects. “The expo for young scientists provides learners with an opportunity to turn their dreams into tangible products,” says Parthy Chetty, director of corporate affairs at Intel. “It enables them to sharpen their innovative skills and equips them with the requisite knowledge to participate meaningfully in a knowledge-driven economy,” he says.
“It is important that companies engage in science projects and provide learners with relevant information that will help them make informed study and career choices,” said Chetty. “A career in science is hard work, but offers rewarding and exciting experiences.”
The Intel ISEF is an annual science competition exclusively for students in grades 9 and 12. The 2009 fair will bring together over 1500 leading young scientists from more than 45 countries to compete for more than $3 million in scholarships and prizes. The top winner will receive a scholarship worth $50 000. For best-of-category awards, 18 winners will be selected and each will receive a $5000 scholarship and a new laptop.
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...