News


Otto to distribute Simcom products

21 January 2009 News

Otto Marketing has been appointed as Simcom Wireless Solutions’ local partner to distribute and offer design support to ODMs and OEMs who intend to or have already integrated Simcom’s modules into their products within the southern African region. Most of the modules are locally and worldwide type approved and Otto has experience working with individual customers for network operator approvals. Otto can offer a demonstration of sample applications that can be performed by the modules using Simcom’s development kits.

Simcom manufactures high-quality wireless modules for different technology platforms. The company’s product offering covers the major wireless segments including GSM/GPRS/EDGE, WCDMA/HSDPA, TDSMA and GPS. These products offer a rich set of features to allow customers to develop powerful applications in M2M communications, telematics, metering and tracking.

Simcom has demonstrated an ability to offer market-relevant products that incorporate ever-advancing technological innovations without discarding support to legacy products that have already been built into existing products. Worldwide partnerships with companies like eDevice, Sensorlogic, Kineto and Datang Mobile has enabled Simcom to release best-of-breed, market-sensitive products with industry standard features, in addition to an ability to customise existing products to best suit the needs of ODMs and OEMs.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033, [email protected], www.otto.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved