GE Sensing & Inspection Technologies
February 2010
Events
 
The phoenix|x-ray product line of GE Sensing & Inspection Technologies is presenting its x|act technology for simple and intuitive CAD-based μAXI of solder joints with very high image magnification and repeatability and thus a very low escape rate at its 180 kV micro- and nano-focus X-ray inspection systems microme|x and nanome|x. Both offer 3D computed tomography as an additional benefit.
GE will be on stand H4.
For more information visit  www.geinspectiontechnologies.com
	
 
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