IPC updates marking and labelling standard
28 April 2010
News
IPC recently released the A revision of IPC J-STD-609, ‘Marking and Labelling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes’. This standard presents a marking and labelling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Since the original release of J-STD-609 in July 2007, many new solder alloys have entered the market as lead-free technology matures. Companies like HP were witnessing how different component suppliers using the same (new) BGA ball alloy were selecting two different ‘e-codes’ to mark their components. To address the confusion in categorising the new alloys, Dr. Gregory Henshall, environmental programme manager for HP’s enterprise servers, storage and networking division, took an active role on the combined working group of IPC and JEDEC to pursue the A revision of J-STD-609.
“Confusion adds time and cost to the manufacture of printed circuit assemblies and also increases the chance for errors in material usage,” says Henshall. “The revisions made to the standard resolve this confusion, and include examples for many common alloys.”
J-STD-609A provides explicit guidance on the marking and labelling of components and printed circuit boards using the wide range of solder alloys now available in the market. Specifically, the standard enables clear identification of: assemblies with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes; and conformal coatings. In addition, the standard prescribes the maximum component temperature that should not be exceeded during assembly or rework processing.
For more information visit www.ipc.org
Further reading:
From the Editor's desk: Growth through inclusivity
Technews Publishing
News
As the engineering fields in South Africa continue to make progress toward gender equality, we are finally starting to see the presence and contribution of women in engineering and industrial roles.
Read more...
KITE 2025 proves its value
News
The KwaZulu-Natal Industrial Technology Exhibition (KITE) 2025 confirmed its place as KwaZulu-Natal’s must-attend industrial event, drawing thousands of industry professionals.
Read more...
Otto Wireless Solutions announces promotion of Miyelani Kubayi to technical director
Otto Wireless Solutions
News
Otto Wireless Solutions is proud to announce the promotion of Miyelani Kubayi to the position of technical director, effective 1 August 2025.
Read more...
DMASS experiences continued slowdown
News
The European electronic components distribution market continued its downward trajectory in the second quarter of 2025, according to new figures released by DMASS.
Read more...
World-first zero second grid-to-backup power switch
News
JSE-listed cable manufacturer, South Ocean Electric Wire, has completed a solar installation it says marks a global first: a seamless switch from grid to backup power in zero seconds.
Read more...
News
OMC deploys cobots to improve throughput 10x, while maintaining quality and ensuring consistency of fibre optic production.
Read more...
Cobots for opto production line
News
OMC deploys cobots to improve throughput 10x, while maintaining quality and ensuring consistency of fibre optic production.
Read more...
SACEEC celebrates standout industrial innovation on the KITE 2025 show floor
News
Exhibitor innovation took the spotlight at the KITE 2025 as the South African Capital Equipment Export Council announced the winners of its prestigious New Product & Innovation Awards.
Read more...
SA team for International Olympiad in Informatics
News
The Institute of Information Technology Professionals South Africa has named the team that will represent South Africa at this year’s International Olympiad in Informatics.
Read more...
Anritsu and Bluetest to support OTA measurement
News
Anritsu Company and Sweden-based Bluetest AB have jointly developed an Over-The-Air measurement solution to evaluate the performance of 5G IoT devices compliant with the RedCap specification.
Read more...
printer friendly version