|
|
|
IPC updates marking and labelling standard
28 April 2010, News
IPC recently released the A revision of IPC J-STD-609, ‘Marking and Labelling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes’. This standard presents a marking and labelling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Since the original release of J-STD-609 in July 2007, many new solder alloys have entered the market as lead-free technology matures. Companies like HP were witnessing how different component suppliers using the same (new) BGA ball alloy were selecting two different ‘e-codes’ to mark their components. To address the confusion in categorising the new alloys, Dr. Gregory Henshall, environmental programme manager for HP’s enterprise servers, storage and networking division, took an active role on the combined working group of IPC and JEDEC to pursue the A revision of J-STD-609.
“Confusion adds time and cost to the manufacture of printed circuit assemblies and also increases the chance for errors in material usage,” says Henshall. “The revisions made to the standard resolve this confusion, and include examples for many common alloys.”
J-STD-609A provides explicit guidance on the marking and labelling of components and printed circuit boards using the wide range of solder alloys now available in the market. Specifically, the standard enables clear identification of: assemblies with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes; and conformal coatings. In addition, the standard prescribes the maximum component temperature that should not be exceeded during assembly or rework processing. For more information visit www.ipc.org |
|
|
| Share: |
 |
Via email client |
 |
 |
 |
 |
print |
|
|
|
|
|
Further reading:
- Electronics news digest
26 June 2019, News
South Africa
• South Africa is looking to take on a leading role in the international space weather monitoring community. Space weather events are capable of seriously disrupting modern technologies ...
- Clearing the static: ESD testing and monitoring – Part 2
26 June 2019, Altico Static Control Products, News
Once you’ve identified an ESD protected area (EPA) and the combination of ESD (electrostatic discharge) control products your facility requires, continuous testing and monitoring need to be conducted. ...
- AI on a chip
26 June 2019, News
Researchers have created a machine learning library programmed in C that can run on microcontrollers, and on other platforms such as PCs, Raspberry PI and Android.
- From the editor’s desk: Local developments using solar power
26 June 2019, Technews Publishing, News
It’s always great to see local developers doing good work, and Dataweek always enjoys getting a chance to feature them. Sadly, people seldom share with us the interesting things they’re working on, whether ...
- CSIR pushes to localise technologies
26 June 2019, News
The Council for Scientific and Industrial Research (CSIR) has pledged to work closely with the private sector and innovation partners in developing and localising technologies to support the advancement ...
- SIMCom product seminar to be held next week
26 June 2019, Otto Wireless, News
Otto Wireless Solutions, in conjunction with SIMCom, will be hosting an informative half-day seminar at Riversands, Fourways on 10 July 2019. In addition to a brief product presentation by Otto Wireless ...
- Demand for local products highlighted at LME expo
26 June 2019, News
The Local Southern African Manufacturing Expo (LME), held in Johannesburg in late May, managed to draw a respectable 3473 visitors in its first ever outing. “The Expo was the culmination of a vision that ...
- Electronics news digest
29 May 2019, News
South Africa
• South Africa will soon join the World Economic Forum’s (WEF) Centre for the Fourth Industrial Revolution Network (C4IR Network) alongside China, India and Japan by launching an affiliate ...
- Clearing the static: ESD testing and monitoring - Part 1
29 May 2019, Altico Static Control Products, News
Static energy is an unseen threat, and the only way of knowing how to control it is by testing. Depending on your industry and application, there will be specific resistivity requirements that will govern ...
- From the editor’s desk: US-China trade war hits chip makers
29 May 2019, Technews Publishing, News
The escalating trade war between the US and China has the global economy on high alert, and unless things normalise soon it is going to have massive ramifications on many industries.
Following US president ...
- Otto Wireless scoops two new agencies
29 May 2019, Otto Wireless, News
Otto Wireless Solutions has recently been appointed as the official distributor for two overseas manufacturers of RF and microwave components: Taiwanese microwave ceramic components designer and manufacturer, ...
- Actum acquires Band-It business in South Africa
29 May 2019, Actum Electronics, News
The Actum Group has acquired Banding and Identification Solutions Africa (BISA), the leading distributor of Band-It clamping and fastening products in South Africa. The transaction, which was finalised ...
|
|
