Guidelines for BTC assembly
25 May 2011
News
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093: ‘Design and Assembly Process Implementation for Bottom Termination Components.’ This standard describes the critical design, assembly, inspection, repair and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallised terminals that are an integral part of the component body.
Over the past few years, this class of components, which includes QFN, DFN, SON, LGA, MLP and MLF, has seen dramatic growth. QFNs, LGAs, passives and even power components have shifted their contacts to the bottom of the package, providing significant cost savings for semiconductor suppliers; and with shorter signal traces, improved speed. Together, these factors have prompted many users to migrate to bottom-termination packages.
IPC-7093 provides direction for a package style that has proven difficult to manage even though its usage is now widespread. “Strict process control is key when using these packages,” explains Dieter Bergman, IPC staff liaison to the IPC 5-21h task group and director of technology transfer. “The package base and board have to be very flat, and the amount of solder volume that is applied has to be properly related to the size of the terminations being attached to the surface.”
Attempts by chipmakers to reduce the number of problems have not been particularly effective. IPC-7093 provides guidelines for those striving to achieve perfection while dealing with real-world issues. The standard details techniques for component placement and solder application, as well as processing issues. Reflow solder printing and reflow profile recommendations are also provided. The document also includes a number of photos and illustrations that will help users understand the root causes of problems.
Managers, design and process engineers, operators and technicians who deal with electronic design, assembly, inspection and repair processes will find the information contained in IPC-7093 useful and practical, especially if they are using or considering tin-lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC-type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes, and provides guidance information to component suppliers regarding the issues being faced in the assembly process.
Further reading:
From the editor's desk: Inspiring the next generation
Technews Publishing
News
Welcome to the August issue of
Dataweek. Peter Howells is still on leave, so I am back for this issue. I hope you enjoy the content and find value in it.
August is Women’s Month in South Africa,
...
Read more...
Procurement is becoming a competitive advantage
RS South Africa
News
As mining, manufacturing and industrial businesses continue to navigate rising costs, supply chain disruption and increasing pressure to improve operational performance, procurement and inventory management have become strategic business priorities rather than simply administrative functions.
Read more...
Powell Electronics signs partnership agreement with IOT Electronics
IOT Electronics
News
Powell Electronics has entered into a partnership agreement with IOT Electronics to strengthen its presence across southern Africa.
Read more...
Omniflex delivers ICCP systems across London
Omniflex Remote Monitoring Specialists
News
Omniflex has supplied impressed current cathodic protection (ICCP) systems for a range of prominent buildings across London, helping to protect reinforced concrete structures from corrosion and extending their service life.
Read more...
New appointments for Würth Electronics South Africa
Würth Electronics South Africa
News
New appointments for Würth Electronics South Africa
Read more...
MTN celebrates 80 Western Cape digital graduates
News
Eighty unemployed young people from across the Western Cape have successfully completed MTN South Africa’s Digital Skills for Digital Jobs (DS4DJ) programme, earning accredited qualifications in Data Analytics, Systems Development and Cybersecurity.
Read more...
GirlCode Hackathon 2026 kicks off across South Africa and Botswana
News
GirlCode, in partnership with Absa Group, Truecaller, MTN, SAP Fioneer, RS South Africa and other ecosystem partners, successfully hosted the first leg of the 2026 GirlCode Hackathon.
Read more...
Rooibos heads to space
News
A South African scientific initiative linking agriculture and space research has officially launched today with the Rooibos in Space programme at Parklands College’s Innovation Centre in Cape Town.
Read more...
From the editor's desk: Local can be international
Technews Publishing
Editor's Choice News
Welcome to the July 2026 issue of
Dataweek. As you can see from this introduction,
Dataweek’s regular editor, Peter Howells, is on extended leave and I am filling the void in his editor’s column – hopefully without being too boring.
Read more...
Landis+Gyr EMEA introduces new company name: EYKON
News
EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.
Read more...
printer friendly version