Electronics manufacturing webinars

22 June 2011 News

IPC announced a series of webinars for June, July and August 2011. Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organisations cost-effective opportunities to bring important new information directly to their conference rooms.

The following webinars will run from 10:00 to 11:00 US Central time (17:00 to 18:00 South African time):

PCB design and assembly process planning for QFN and other bottom termination components

Vern Solberg, STC Madison

Thursday, 23 June

Conflict metals: How this issue will affect your business

Tony Hilvers and Fern Abrams, IPC

Monday, 11 July

A new method measuring conformal coating adhesion

Chris Hunt, Ph. D., National Physical Laboratory (NPL)

Wednesday, 13 July

Cleaning highly dense circuit assemblies and advanced packages

Mike Bixenman, DBA, Kyzen Corporation

Tuesday, 19 July

Printed electronic (PE) circuit process for LED interconnection

Mike Dubois, Caledon Controls

Wednesday, 20 July

A new approach for early detection of PCB cratering failures

Anurag Bansal, Ph.D., Cisco Systems

Wednesday, 27 July

DFM – Design for Manufacturing

Cheryl Tulkoff, DfR Solutions

Wednesday, 3 August

ITAR compliance basics and cyber security for Level 3 manufacturers

Bob Richardson and John Burton, TeamITAR

Tuesday, 9 August

Effects of flux residues on reliability

Eric Bastow, Indium Corporation

Wednesday, 10 August

The registration fee for each webinar is $75 per login for IPC members and $100 per login for non-members. An organisation can stretch its staff development budget by training multiple employees in a conference room, equipped with a speakerphone and projector.

For more information visit www.ipc.org/summer-webinars

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