Apacer Technology, Accelerated Memory Production and Diamond Systems recently unveiled RSODIMM, a specification for rugged SODIMM memory.
The new memory module format offers a cost-effective way to satisfy the reliability requirements of performance-critical embedded computing applications in markets such as transportation, industrial automation, medical, energy, military and aerospace.
The RSODIMM standard extends the conventional JEDEC SODIMM format by 10 mm in the dimension perpendicular to the connector. There, a pair of added mounting holes enables secure attachment of the modules to the host CPU board. The resulting enhanced resistance to shock and vibration enables RSODIMM memory’s use in vehicle applications and other harsh environments with greater confidence. The modules have successfully been tested to 12G, per MIL STD 202, and are already designed into a military vehicle application, proving their customer acceptance.
In all other respects – including connector signal assignment and module functionality – RSODIMM and ordinary SODIMM modules are identical. Compatibility with standard SODIMM sockets avoids the need for expensive connectors, leverages familiar layout techniques, and makes it easy to adapt both SBC and memory designs to the new format. Although not mandated by the RSODIMM specification, module suppliers will typically rate their RSODIMM products for -40°C to +85°C or -20°C to +70°C operation, in recognition of the harsh environments in which they are likely to be used.
“The RSODIMM specification is an open standard, available for use without licence,” noted Jonathan Miller, founder and CEO of embedded computing solutions specialist Diamond Systems, which originated the standard.
Diamond’s recently-announced Aurora single board computer is the industry’s first SBC to implement an RSODIMM memory socket.
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