News


Industry consortium looks into whole-line electronic equipment assembly

31 October 2012 News

An informal industry consortium is collaborating on a common approach to whole-line electronic equipment assembly.

A two-day industry seminar chaired by Assembléon in September brought together suppliers of screen printers, reflow ovens, inspection systems, conveyors and software.

Sixteen leading suppliers attended: Aegis, Assembléon, BTU, DEK, Heller, Koh Young, Mentor, Mirtec, Nutek, Rehm, Rommel, Seho, Speedline, VI Technology, Vitronics Soltec and Yestech.

“Over the last couple of years, economic turmoil has caused manufacturers to lose key personnel and process expertise, and they are now turning to suppliers for technology support,” said Mark Maas, senior product marketing Manager at Assembléon. “That places much more responsibility on suppliers to solve their customers’ problems. They are increasingly being asked to do complete-line audits, and need to offer whole-line solutions.”

Recent developments like Assembléon’s iFlex, which offers independent dual lanes, are making equipment assembly more flexible but also placing extra demands on upstream and downstream equipment. Taking full advantage of the flexibility and power of the iFlex means that screen printers need extra speed and flexibility to supply different boards to the dual lanes.

Ovens need to cope with different temperature profiles for the different lanes. The whole line needs to supply materials, components, boards and schedules on demand at high speeds in the face of the virtually continual product changeovers in today’s high-mix environments.

Meanwhile, the push towards ultra reliable manufacturing can reduce faults below 10 defects per million components for a complete line. This remarkably low level demands close cooperation between equipment suppliers to solve quality issues immediately (particularly since the industry average is well above 70 dpm).

The consortium is sharing knowledge of processes, products, applications, trends and solutions. It will also address present problems with Overall Equipment Effectiveness (OEE). “OEE is difficult to measure: there is much variation in how it is measured by equipment assemblers, and it means different things to different manufacturers,” explained Maas.

The seminar included talks and presentations by industry experts on topics including dual-lane production, software, standardisation, knowledge transfer, roadmaps and trends.

The companies plan to produce white papers, set up task groups, share roadmaps and present common recommendations to standards committees. In particular, improvements are needed on communications protocols, and IPC 610 workmanship and IPC 9851 mechanical and electrical interface standards.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved