Manufacturing / Production Technology, Hardware & Services


Latest Articles

World-first 016008 mm component placement
28 February 2026
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.

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Lifecycle and obsolescence: Protecting electronics through process
30 March 2026, Production Logix
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.

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Maximising squeegee quality and durability
30 March 2026, Testerion
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.

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NeoDen ND2 PCB screen printer
30 March 2026, ZETECH ONE
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.

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Understanding the BGA rework process
30 March 2026, Techmet
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.

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Flexible three-process reflow soldering system
30 March 2026, Truth Electronic Manufacturing
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.

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Inline vapour phase soldering for high-volume production
30 March 2026, MyKay Tronics
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.

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Global electronics solutions since 1964
30 March 2026, IMP Electronics Solutions
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.

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Driving excellence in electronics manufacturing
30 March 2026, Jemstech, Editor's Choice
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.

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When do you need Nitrogen in reflow?
30 March 2026, Truth Electronic Manufacturing
Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.

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Yamaha extends surface-mount software toolkit
30 March 2026, Truth Electronic Manufacturing
The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.

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High-precision smart reflow oven platform
30 March 2026, MyKay Tronics
The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.

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Intelligent high-precision digital deposition platform
30 March 2026
ioTech has introduced the io600, a next generation digital deposition platform designed to bring intelligence, precision, and scalability to modern electronics manufacturing.

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ESE’s solder paste printer now available in SA
30 March 2026, ZETECH ONE
Engineered for high-speed, high-accuracy applications, the ESE ES-FA1 solder paste printer eliminates the traditional bottlenecks of manual stencil changes and paste management, making it an ideal solution for Tier 1 EMS providers and advanced semiconductor assembly.

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In sync with the line
30 March 2026, Testerion, Editor's Choice
In modern SMT lines, stencil printing must meet two requirements at the same time: it has to ensure a reproducible solder paste volume, while adhering to the specified line cycle time.

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Inventec enhances design for manufacturing excellence with Siemens’ software
30 March 2026, ASIC Design Services
Siemens recently announced that Inventec Corporation has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen its design-for-manufacturing efficiency.

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Outscale your competition
EMP 2026 Electronics Manufacturing & Production Handbook
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

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MTN SA Foundation drives youth pathways into the digital economy
EMP 2026 Electronics Manufacturing & Production Handbook
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

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Downstream demand, system reliability, and the expanding role of engineering-led distribution
EMP 2026 Electronics Manufacturing & Production Handbook
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

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The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

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