Manufacturing / Production Technology, Hardware & Services


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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
EMP 2026 Electronics Manufacturing & Production Handbook, Testerion, Editor's Choice
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

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Understanding solder dross: causes and control strategies
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing, Editor's Choice
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

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Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

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Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

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The causes of solder balls in robotic soldering
EMP 2026 Electronics Manufacturing & Production Handbook
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

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Material challenges for superconducting quantum chips
EMP 2026 Electronics Manufacturing & Production Handbook
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

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UV curing oven for high-efficiency PCB production
EMP 2026 Electronics Manufacturing & Production Handbook, Techmet
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.

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Automatic stencil cleaning
EMP 2026 Electronics Manufacturing & Production Handbook, ZETECH ONE
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.

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Versatile wave soldering
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
The EMST Stallion fc - PLC is a highly capable wave soldering machine engineered for precision and productivity in electronics manufacturing.

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Robot series enhances repetitive production applications
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
The Robots 9494 Series from Quick-Global are versatile automation solutions designed to enhance industrial workflows where precision and repeatability are key.

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Precision PCB cleaning system
EMP 2026 Electronics Manufacturing & Production Handbook, Electronic Industry Supplies
The PBT Works HyperSWASH III is a top-tier automatic PCB cleaning system engineered for precision, high throughput, and advanced process control in modern SMT production.

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High-performance stencil printer
EMP 2026 Electronics Manufacturing & Production Handbook, Priben
The DEK NeoHorizon printer is a flexible, high-performance solder paste stencil printer engineered for modern SMT production.

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PCB graphical repair system
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
The GRS550 from Polar is a flying probe PCB repair system, designed to assist in repair and recovery of expensive boards with hard-to-find faults.

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Next-generation jet printing
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.

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Yamaha Motor releases YRH10W Hybrid Placer
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
This model is based on the YRH10 and is compatible with 12-inch wafers and capable of transporting large PCBs.

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Efficiency and consistency in vapour phase soldering
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
The ASSCON VP1000-1080 and VP1000-1580 vapour phase soldering systems redefine large-format assembly production with precision, reliability, and ease of use.

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General-purpose chip mounter
EMP 2026 Electronics Manufacturing & Production Handbook, ZETECH ONE
The Hanwha Semitech XM520 is a high-performance, general-purpose chip mounter engineered for flexible, efficient SMT assembly.

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PCB depaneling machine
EMP 2026 Electronics Manufacturing & Production Handbook, Hot Tools
The PCBS-400V industrial linear blade PCB depaneling machine is engineered for manufacturers who demand clean separation, repeatable accuracy, and dependable throughput in high volume electronics production.

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Intelligent storage solution
EMP 2026 Electronics Manufacturing & Production Handbook, ZETECH ONE
The Essegi ISM UltraFlex 3600 is an advanced intelligent storage solution designed to optimise component management in high-speed PCB assembly environments.

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Pick-and-place versatility
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
The Europlacer atom ii-A1 is a compact, ultra-flexible surface mount technology placement module designed to bring precision and productivity to electronic assembly lines.

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