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How to analyse blind via hole failures It has become common practice to use blind, filled and stacked vias in many portable electronics products. Experience has shown that this method of interconnection is reliable, provided the fabrication process is well defined and controlled. |
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PCB microsectioning – paying attention to detail In our high-tech world, it’s easy to overlook the importance of the humble printed circuit board (PCB).
Buried in each electronic gadget or appliance there’s always at least one PCB and each one has |
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X-ray dose considerations The benefits of using X-ray technology in the electronics industry to inspect printed circuit board assemblies are well proven.
This article summarises X-ray radiation dose, and the techniques that |
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Product development issues explored in new video Printed circuit broker, Elmatica, recently released a new film about product development, explaining why cooperating with an experienced partner could be a smart move.
“We have several times seen the |
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Flux management system earns APEX award BTU International was awarded a 2019 NPI award in the reflow soldering category for its new Aqua Scrub flux management technology. The award was presented to the company during a ceremony that took place |
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Solder dross recovery system Stannol’s Solder Saver is a mechanical device to reduce dross, which occurs as an unavoidable side effect in wave soldering systems.
According to its manufacturer, solder consumption can be reduced by |
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Water-soluble solder paste Indium has released Indium6.6HF solder paste – a new water-soluble, halogen-free solder paste that is compatible with both tin-lead and lead-free alloys. It is designed to provide enhanced stencil printing |
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Affordable soldering station The Industa 550 soldering station, available from Stannol, is an affordable unit characterised by easy operation and universal fields of application.
The temperature is easy to set using a potentiometer, |
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Stencil underside cleaning and manual post-cleaning According to experts, between 60 and 70% of all defects and failures during or after the soldering process are attributable to defects in the printing process (Figure 1). In general, these are faulty |
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What you need to know about the Hermes standard Taking advantage of modern TCP/IP communication and XML data format technologies, Hermes is effectively a replacement of the more than 20-year-old SMEMA standard. |
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Contract electronics manufacturing in SA We asked representatives from two leading South African contract electronics manufacturers to share some of their insights into this complex landscape. |
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BGA optical joint inspection criteria and test methods BGA failures occur for component, printed board, process or design related reasons, and on some occasions, both X-ray and optical inspection cannot easily provide the answer. |
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