The importance of periodic verification 31 July 2024, MyKay Tronics Whilst many people understand the basic concepts of electrostatic discharge (ESD), and as a result insist on a properly equipped ESD Protected Area (EPA), it is then forgotten about.
Cutting-edge alloy for solder paste 31 July 2024, Techmet Indium Corporation has introduced Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
Elevating PCB assembly with environmental stress screening 31 July 2024, Production Logix As part of Production Logix’s suite of services, Environmental Stress Screening (ESS) is poised to revolutionise the electronics manufacturing space and redefine the assembly process on the ground.
QA introduces 55 crown tip style for long stroke probes 31 July 2024, Techmet To capture smaller leads and posts in dual-level testing, QA’s new self-cleaning 55 steel crown tip style is now available in a 0,400-inch long stroke 075-40 and X50-40 probe series.
RS PRO ensures automation efficiency 31 July 2024, RS South Africa RS South Africa has announced the launch of its RS PRO Automation Efficiency, which enriches the RS PRO portfolio, with over 1100 new products spanning more than 18 technologies.
Laser versus conventional soldering 31 July 2024 As electronic circuit boards become thinner, and electrical components more multilayered, technology is evolving so rapidly that conventional soldering methods are no longer applicable.
NPM-GH autonomous factory solution 31 July 2024, Techmet With predictive and targeted maintenance options to maximise uptime, Panasonic’s NPM-GH pick-and-place machine is the first step to a truly autonomous factory.
New technology for AOI system 31 July 2024, Techmet MIRTEC’s upcoming inspection system will include two of its patent pending technologies to provide unparalleled performance, ART’s exclusive optical systems, and TAL 3D SCAN’s laser scanner.
Technology Station in Electronics 31 July 2024 Services offered include electronics and mechanical product development, short learning programmes, consultation, and state-of-the-art manufacturing.
New Type 6 jetting solder paste hits market 31 July 2024, Techmet Indium Corporation has introduced a new jetting solder paste, the PicoShot NC-6M, which is a no-clean, halogen-free, Type 6 powder-size material.
New handle for the XP Series joystick 30 April 2024, Brabek The new MF handle meets market demands to combine a traditional compact design with multiple functionalities and customisation options.
Next-level conformal coating 30 April 2024, Techmet The ASYMTEK Select Coat SL-1040 Series is Nordson Electronics Solutions’ most advanced conformal coating solution for high-volume production.
The impact of ML in robotics 30 April 2024 The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
ITW EAE wins product introduction award 30 April 2024, Allan McKinnon & Associates ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
Revolutionising clean air in electronics manufacturing 28 March 2024, Allan McKinnon & Associates Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
High-speed multi-function dispensing 28 March 2024, Techmet The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Optical inspection for SMT 28 March 2024, Techmet The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Yamaha introduces upgrades to its 3D AOI systems 28 March 2024, Truth Electronic Manufacturing Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Flexible printed electronics substrates 28 March 2024 New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
