DSP, Micros & Memory


8 bit microcontroller with 32 K flash ans SMBus for smart battery portables

15 March 2000 DSP, Micros & Memory

Mitsubishi Electronics America's Electronic Device Group has announced the sample availability of the M37516, an 8 bit smart battery microcontroller that has 32 kbytes of on-chip flash memory to enable in-circuit flash reprogramming, a SMBus (system management bus) interface that enables communication with other SMBus compatible Smart Battery System (SBS) devices, a 10 bit ADC for precise battery charging/discharging control, and peripheral functions in a package small enough squeeze into battery packs.

The company says that operating on a single, 5 V power supply, the microcontroller's on-chip Flash memory supports parallel, serial, and CPU programming modes, and allows users to control programming and erase functions via software commands. Also, the device's SMBus interface can be used as an I2C interface using software switching. The device conforms to SM0Bus 1.1 specifications.

The M37516 smart battery flash microcontroller is specifically designed for smart battery systems for portable applications that use the industry- standard SMBus serial communication protocol. The M37516 microcontroller connects with Mitsubishi's keyboard controller (M38867 or M38869) and smart battery charger/selector IC (M62255) via the two-wire, serially configured SMBus to make a complete smart battery system.

The M37516, which normally draws 34 mW of power, is designed to reduce smart battery system power consumption in several ways. Its built-in clock generation circuit operates via a ceramic resonator or quartz crystal oscillator. The device features 2,7-5,5 V operation at a 4 MHz oscillation frequency and 4,0-5,5 V operation at an 8 MHz oscillation frequency. It has a 32 kHz secondary clock source and power-down modes. The 'wait' power-down mode stops the internal clock but not the external oscillator so the system draws 25% of the normal operating current; the 'stop' power-down mode stops both the internal clock and external oscillator, drawing only 40 µA of current.

Key features: Flash memory - 32 kbytes; RAM - 1024 bytes; Serial I/O - 8 bit x 1 (UART or clock synchronised) and 8 bit x 1 (clock synchronised); Multimaster I2C bus interface circuit; four 8 bit timers; pulse width modulation - 8 bit x 1; A/D converter - 10 bit x 8 channel; watchdog timer - 16 bit x 1 channel; Two clock generator circuits (32 kHz and 8 MHz).

For further information about Mitsubishi Electronics contact local representative, Arrow Altech Distribution, (011) 923 9600.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved