CompactPCI is the bus standard developed by the PICMG which allows high-performance PCI bus technology to be used in industrial environments.
Erni's passive CompactPCI backplanes (max eight slots) are mounted in standard 19" subracks which can be fitted with Eurocard-format daughter cards to meet the needs of the application. The metric 2,0 mm grid connector system (to IEC 1076-4-101) is used as the connecting element. This multipole system allows 220 signal contacts (five rows each with 44 contacts) for a 3U slot of which two additional rows of contacts are used for shielding.
A CompactPCI slot comprises two connector modules. The 'A' module transmits signals for 32-bit transfer and also contains a 'multifunction block' which is used for slot coding. 64-bit transfers run via the modified 'B' module. On this connector, 20 signal contacts are reserved for future applications and extension.
The CompactPCI bus family from Erni includes both 3U and 6U backplanes and fully complies with the cPCI specification, Rev.1.0 of 1 November 1995. The Erni bus structure is characterised by the following main features:
* 10 layer design with exterior layer providing full shielding.
* Superior decoupling of supply voltages.
* Either 5,0 V or 3,3 V operation possible (separate VI/O level).
* Controlled impedance (65 Ω) using stripline technology.
Reliable isolation for modern networks ASIC Design Services
Computer/Embedded Technology
The Pro-Tek5 PTI Series delivers reinforced 5 kV Ethernet isolation for applications that demand robust protection, reliable signal integrity, and full IEEE802.3 performance.
Read more...Clearing the Static: Ensuring effective ESD control Actum
Circuit & System Protection
To maintain reliable electrostatic discharge control, regular testing and accurate measurement are essential, with grounding products and ESD testing equipment being vital.
Read more...Clearing the Static: The importance of ESD audits Actum
Circuit & System Protection
An ESD audit is the first step in establishing an effective static control programme in the workplace, and will help identify vulnerable areas and potentially hazardous static zones that require improvement.
Read more...Next-gen modules for rugged edge AI systems Altron Arrow
Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
Read more...Fanless multimedia edge PC Vepac Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...Advanced industrial connectivity at the edge Future Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...A software-based controller for the industrial future Phoenix Contact
Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.
Read more...5G mobile hotspot with integrated multimodal AI capabilities CST Electronics
Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
Read more...Panasonic TOUGHBOOK 33 2-in-1 detachable Vepac Electronics
Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
Read more...Clearing the Static: ESD containers and packaging Actum
Circuit & System Protection Vacuum forming ESD
Electronic components can be damaged by electrostatic discharges. To protect against such damage, electronic assembly parts are often transported or stored in vacuum formed component ...
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version