Laminated interface material combines dielectric strength, conductivity and superior shielding

9 April 2003 Passive Components

Power Devices' EMI-STRATE thermal interface systems are a range of products specifically designed to suppress radiated emissions generated in high frequency transistor applications, in addition to providing the best possible heat transfer from device to heatsink

EMI-STRATE's special laminated construction includes an interior layer of 10 mm thick copper, which provides superior EMI shielding and thermal flow and a rigid pinout for the ground connection.

The laminate's two exterior 'layers' of ISOSTRATE, the company's electrically isolating thermal interface, give EMI-STRATE built-in superior dielectric isolation.

The ground connection can be specified either to the left or to the right-side of the device area. It can be custom-formed by the user for PCB connection. This ground connection can be supplied tin-dipped for improved solderability.

The standard configuration can be tailored to any application-specific requirements for single or multiple devices.

Shielding effectiveness is measured in decibels (dB) and will vary with frequency and voltage.

Generally, EMI-STRATE is rated at 60 dB or better, while maintaining its superior thermal performance.

The effectiveness of EMI-STRATE is field-proven in military and high-voltage commercial applications, says the company.

Custom configuration of EMI-STRATE can be offered with both 2 mm and 10 mm copper in single and multiple transistor applications.

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