23 April 2003Manufacturing / Production Technology, Hardware & Services
Microchip says that its new 512 Kb I2C compatible serial EEPROMs are the first to be available in an 8-pad dual flat no-lead package. The 6 x 5 x 0,9 mm DFN packages are ideal for low-headroom applications, reducing cost and increasing available board space.
The 24LC512, 24AA512, and 24FC512 devices use Microchip's advanced PMOS electrically erasable cell process technology to produce high-density, low-power EEPROMs in one of the thinnest packages available. PEEC process technology also ensures reliability, achieving more than 200 years data retention and 1 000 000 erase/write cycles at 85°C. Users of its 128 Kb or 256 Kb EEPROMs can use these higher-density EEPROMs while retaining the same footprint, says the company. Additional packages include an 8-lead PDIP, 8-lead SOIC and 14-pin TSSOP.
The devices have a page-write capability of up to 128 bytes and can perform random reads throughout the entire array. Functional address lines allow up to eight devices on the same bus for a maximum of 4 Mb total address space. Additional features include a fast write time of 5 ms, a clock rate of 400 kHz throughout the operating voltage of 2,5 V-5,5 V and temperature range of -40 to +85°C. The 24FC512 can operate at a bus speed of 1 MHz and the 24 AA512 has an operating voltage of 1,8 V-5,5 V.
For more information contact Avnet Kopp, 011 809 6100, Memec SA, 021 674 4103, Tempe Technologies, 011 452 0530.
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