Actel has announced the moisture-sensitivity level 2 (MSL2) certification of its eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP). A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed temperature in an uncontrolled environment. This offers customers greater flexibility for storage and manufacturing, without compromising system reliability, says the company.
This has significant economic benefits for the end-user equipment manufacturer. For packages with higher MSLs, shelf life deteriorates significantly. Consequently, the manufacturer may add a dry-bake or re-bake step, often required prior to mounting the package on a board or module, in their process. The baking process requires dry bags, trays for baking, moisture indicators, desiccant material, controlled-environment storage and various other logistic challenges, including product staging. Such processes increase costs as well as cycle time.
The eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3000, 6000 and 12 000, respectively. Actel offers a range of chip-scale packages, including 49-, 128- and 180-ball packages.
For more information contact Kobus van Rooyen, ASIC Design Services, 011 315 8316, [email protected]
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