DC bus converter chipset redefines distributed power architecture
7 May 2003
Power Electronics / Power Management
International Rectifier has unveiled the first group in the family of DC Bus converter chipsets that it claims redefines the underlying distributed power architecture for 48 V-input, 150 W board-mounted power (BMP) converters used in telecom and networking systems.
This DC Bus converter chipset architecture establishes benchmarks for overall efficiency, power density and simplicity, claimed to deliver more than 96% efficiency at 20 A/150 Wout in a circuit footprint less than 11 cm2. Also, the chipset enables a 53% size reduction when compared to industry-standard quarter-brick form factors and cuts component count in isolated converters from around 50 components to 20, says IR.
The new chipset consists of a single IR2085S control IC and one pair each IRF7493 primary- and IRF6603 secondary-side HEXFET power MOSFETs, plus the IRF7380 for primary-side bias and an IRF9956 for the secondary-side gate clamp. The chipset is designed for the isolated front-end of two-stage distributed power architectures (DPA) with an intermediate bus voltage feeding non-isolated point-of-load (POL) converters.
Two-stage DPA schemes do not require a tightly regulated intermediate bus voltage, since the POL will typically accept a relatively wide input voltage, and the POL provides the needed regulation to the load. In addition, multiple DC bus converter chipsets can be placed in parallel for higher power requirements.
For more information contact Avnet Kopp, 011 809 6100, [email protected], www.avnet.co.za
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