Circuit & System Protection


SMT heatsinks for D-PAK

10 September 2003 Circuit & System Protection Access Control & Identity Management

In surface-mounted electronic component (SMD) technology, the use of the D PAK, D PAK (TO252), D2PAK (TO263) and D3PAK (TO268) series packaging is increasingly common. Fischer Elektronik manufactures heatsinks to suit these case types, which provide effective heat dissipation. The special geometry of the copper heatsink with superior heat conductivity, in combination with a solderable surface enables it to be directly soldered onto PCBs.

The heatsink is soldered onto a copper heat spreader surface on the PCB, and the heat is then dissipated by the heatsink to the atmosphere. Since no holes are required in the PCB, the heat spreader surface may be freely designed to meet individual needs.

This indirect heat dissipation, with the heatsink component not being in direct contact, offers the benefit of simplifying the placement and soldering process. The heatsinks which are carried on a reel for automatic feeding may be handled as any other SMT component.



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