Aavid offers slide-on heatsinks for DIP-packed devices. They may be used with or without IC sockets and no glueing is required as they simply slide onto the DIP while a locking catch prevents the heatsink from being dislodged.
Greater thermal efficiency is achieved by a unique design that has two separate conduction paths - one on top and the other on the bottom of the DIP. Slotted fins minimise the boundary layer effect. Double spring action brings top and bottom surfaces into contact with the DIP for a snug fit regardless of DIP thickness for maximum thermal contact. A dynamic air flow design with staggered fins maximises the forced convection thermal performance.
With this heatsink very little additional board space is required.
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