10 September 2003Test & Measurement
Access Control & Identity Management
Aries Electronics is offering a BGA/CSP test and burn-in socket for devices with a pitch from 0,50 mm or larger in applications of up to 1 GHz. The socket features a standard moulded socket format that can accommodate any device package up to 13 mm2. It is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
The socket incorporates solderless pressure-mount compression spring probes accurately located by two moulded plastic alignment pins and secured with four stainless steel screws, making for easy mounting and removal from the burn-in board. The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness.
The socket is rated for 500 000 cycles, spring probe contacts are 9 to 12 g per contact for 0,50 to 0,75 mm pitches, and 17 to 20 g per contact for 0,80 mm pitches and larger. Operating temperature of the socket ranges from -55 to 150°C.
The moulded components are UL94V-0 Ultem and machined components are UL94V-0 PEEK. Spring probes are heat- treated beryllium copper alloy, plated with 0,75 µm gold over 0,75 µm nickel. All hardware is stainless steel.
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