Computer/Embedded Technology


Processor heatsinks

24 September 2003 Computer/Embedded Technology

The use of microprocessors in PCs and in industrial plants requires specially designed heatsinks for various processors. Fischer Elektronik supplies suitable cooling elements either for free convection or with integral fan motors as active fan coolers.

The heatsinks are fastened to the processor or to its base using special fixing clips and heat conducting foil or by adhesion, depending on which is more suitable and best meets customers' specifications.

The fan motors meet high industrial standards, having withstood the 'burn-in' test and have a long maintenance-free service life. They are available for various voltages and with optional additions of a speed sensor and alarm device. Modifications and special designs are made to meet customers' special requirements.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Vertiv expands rack PDU portfolio
Computer/Embedded Technology
Vertiv has announced its new Vertiv PowerIT rack power distribution units designed to address the rising power needs of data-intensive workloads, including AI and high-performance computing.

Read more...
Bluetooth 6.0 module provides channel sounding
Avnet Silica Computer/Embedded Technology
The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.

Read more...
Rugged PoE switch built for industrial demands
Conical Technologies Computer/Embedded Technology
The rugged Planet IGS-5225-8P4S-12V comes in a compact, rugged, and highly efficient design, making it the switch of choice for engineers working in harsh environments.

Read more...
High-performance networking for demanding environments
Electronic Products Design Computer/Embedded Technology
The Raptor-Epsilon Ethernet switch system is a ruggedised networking solution engineered to deliver advanced switching capabilities, superior reliability, and energy-efficient operation in the most demanding environments.

Read more...
Rugged, I/O-rich NVIDIA Jetson solutions
Electronic Products Design Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.

Read more...
Smallest 13th gen Intel SBC
Vepac Electronics Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.

Read more...
Robust series of vertical-mating battery connectors
Electrocomp Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.

Read more...
Versatile PoE extender
Vepac Electronics Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved