Atmel has added two new members to its tinyAVR Flash microcontroller family with on-chip debug capability. The tiny13 and tiny2313 are designed to address the requirements of battery operated and portable applications by offering low power consumption and a high level of system integration in a small package.
These new AVR devices combine a code efficient and powerful microcontroller with low power flash memory technology. The debugWIRE interface enables on-chip debug, a feature usually available only on much larger devices. As system designers face increasing pressure to bring products to market on shorter development times, production has to start before software development is completed. On-chip debug gives the designer the opportunity to do full debugging on the finished product. The debugWIRE uses the reset line for electrical connection; hence the system designer does not have to sacrifice I/O capabilities to take advantage of the system. DebugWIRE enables on chip debug of 8-bit micro-controller devices in small pin count packages. The 8-pin tiny13 and tiny2313 do not have enough I/O lines to effectively support JTAG interface, which requires four I/Os.
These two devices include numerous features. Integrated brown-out detection removes an external component from the system. The on-chip calibrated RC oscillator may eliminate the external crystal or resonator. The significantly lower power consumption may reduce the cost of the power supply, or extend battery lifetime - the devices can also operate down to 1,8 V. Typical power consumption at 1 MHz, 1,8 V is less than 300 µA, at 32 kHz less than 20 µA. Self programmable flash lets the AVR write to its own program memory, enabling remote updates of the program and parameter storage in the flash memory. The tiny13 and tiny2313 can run at clock speeds up to 16 MHz at 5 V.
Additionally, the tiny2313 has 2 KB of Self Programing Flash memory plus 128 bytes of EEPROM and SRAM plus 18 I/O lines and as many as four PWM channels. The tiny13 has half the memory density and I/O lines plus a 4 channel 10 bit A/D converter.
For more information contact Arrow Altech Distribution, 011 923 9600, EBV-Electrolink, 021 421 5350, Memec SA, 011 897 8600.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.