The SieMo2 Bluetooth module from Siemens is an easy-to-integrate solution for Bluetooth connectivity, with no critical RF design required, offering very quick time to market.
Compactly sized at 12,2 x 13,5 x 2,2 mm, the Class2 Bluetooth V1.1 module operates as an HCI module, and offers superior RF performance. The 4 dBm module has an input sensitivity of -83 dBm, point-to-point functionality of up to seven slaves, and offers a range of up to 70 m without a high gain antenna. Power supply is 2,2-3,6 V, at 26 mA typical current. It also has an extended temperature range making it suitable for automotive applications.
Electrocomp launches new website 25 March 2020, Electrocomp
, News
Electrocomp is inviting visitors to explore its new website, which has been designed to offer a user-friendly experience with improved navigation and functionality while allowing customers to see their ...
Read more...Elegant and functional handheld enclosures 25 March 2020, Electrocomp
, Enclosures, Racks, Cabinets & Panel Products
Hammond Electronics has launched its new 1552 family of handheld enclosures. Initially available in six sizes, the IP54 rated UL94-V0 flame-retardant ABS enclosure features an ergonomic design that fits ...
Read more...Rectifier chip diodes 25 March 2020, Electrocomp
, Circuit & System Protection
Portable electronics, communications, computing and video equipment manufacturers are challenging the semiconductor industry to develop increasingly power efficient solutions with smaller electronics ...
Read more...Innovative power capacitor technologies for wide band-gap semiconductors 26 February 2020, Electrocomp
, Passive Components
Conventional semiconductors based on silicon are being replaced by wide band-gap (WBG) technologies based on GaN (gallium nitride) and SiC (silicon carbide). These demand a great deal from the passive ...
Read more...Electrocomp launches new website 26 February 2020, Electrocomp
, News
Electrocomp is inviting visitors to explore its new website, which has been designed to offer a user-friendly experience with improved navigation and functionality while allowing customers to see their ...
Read more...Automotive-compliant power transformers 26 February 2020, Electrocomp
, Passive Components
Bourns’ inductive components product line is introducing the high clearance/creepage distance isolation power transformer Model HCT Series. These AEC-Q200 compliant high-voltage isolation push-pull transformers ...
Read more...Ultra-low pressure sensor 26 February 2020, Electrocomp
, Analogue, Mixed Signal, LSI
Bourns’ Sensors & Controls product line is introducing a new series of pressure sensors based on microelectromechanical systems (MEMS) technology. The Model BPS125 is 3,3 V capable and is calibrated for ...
Read more...Low-profile pressure transmitters 29 January 2020, Electrocomp
, Analogue, Mixed Signal, LSI
TDK has expanded its portfolio with new EPCOS pressure transmitters whose performance profiles are specially tailored to the requirements of Industry 4.0. These low-profile pressure sensors are characterised ...
Read more...Transient voltage supressor diodes for automotive 29 January 2020, Electrocomp
, Circuit & System Protection
Bourns announced the release of the Model 15KPA-SD-Q transient voltage suppressor diode series. This series was designed for use in DC bus clamping applications and for the protection of sensitive electronic ...
Read more...Dual-channel protectors for high-speed data lines 29 January 2020, Electrocomp
, Circuit & System Protection
Bourns announced the release of the Model TBU-DF055-100-WH, TBU-DF055-200-WH, TBU-DF085-100-WH and TBU-DF085-200-WH bidirectional, dual-channel, High-Speed Protectors (HSPs) for use in data line protection.
The ...
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