100% lead-free small signal discretes in plastic surface mount devices

25 February 2004 News

Royal Philips Electronics has announced the availability of its entire portfolio of small signal discrete plastic surface mount devices (SMD) in 100% lead-free packaging. In these devices, the tin-lead-plating will be replaced by pure matte tin (100% Sn) to meet the strong market trend towards environmentally-friendly products. The conversion of Philips' small signal discretes in plastic SMD will quickly be followed by the conversion of its entire product portfolio of glass and ceramic products to lead-free.

In July 2001, Philips teamed up with STMicroelectronics and Infineon Technologies to develop a proposed standard for defining 'lead-free' and to develop proposed standards related to lead-free products through assessment of factors such as solderability, reliability of alternative materials and characterisation of the Moisture Sensitivity Level. Lead-free, as defined by the companies, is content less than 1000 ppm lead by weight.

Although electronic equipment contains only small amounts of lead, the sheer quantity of devices worldwide means that any reduction in lead content is another healthy step toward a cleaner environment.

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