Lead times for heat shrinkable moulded parts reduced
25 February 2004
News
Tyco Electronics recently announced that nearly 1000 part numbers for its Raychem heat-shrinkable moulded parts are now typically available with 10-day lead times. Previous lead times ranged from four weeks to six weeks. Raychem heat-shrinkable moulded parts are used in many industrial and commercial wire harness applications that require mechanical and environmental protection, but a considerable portion of the parts are used on military platforms.
For example, some of the military specifications included are MS3109, MS3117, MIL-I-81765/1 Type I and II as well as military issued ordnance drawings. Heat shrinkable parts are used in military systems like the M1-A1 Abrams Main Battle Tank, Bradley Fighting Vehicle, AMRAAM, Paladin, M88 and others.
Popular shapes include circular boots, caps, D-subminiature boots, right-angle boots, T-transitions and Y-transitions.
Shorter lead times are beneficial to defence contractors building program upgrades, making repairs or prototyping new designs. Additionally, designers of commercial equipment can specify military-grade products without increasing design cycles.
For more information contact Raytech, 011 314 2186.
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version